Effect of the electrical discharge machining on strength and reliability of TiN/Si3N4 composites

被引:66
作者
Liu, CC [1 ]
Huang, JL [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan
关键词
silicon nitride; titanium nitride; electrical discharge machining;
D O I
10.1016/S0272-8842(02)00217-1
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Conductive TiN/Si3N4 hot pressed composites were processed by electrical discharge machining (EDM) and their microstructure and conductivity investigated. The dependence of surface texture, surface roughness, and materials removal rate on electrical discharge machining conditions including working voltage and feed rate were also analyzed. The flexural strength and strength reliability in terms of Weibull modulus of TiN/ Si3N4 processed by EDM and conventional cutting and polishing are compared. Higher working voltage and current. as well as higher content of TiN result in greater material removal rate. Comparison of the flexural strength and Weibull modulus of the composites processed by EDM with conventional polished samples revealed that the surface with low roughness lead to an increase in strength and reliability for electrical discharge machining. (C) 2003 Elsevier Ltd and Techna S.r.l. All rights reserved.
引用
收藏
页码:679 / 687
页数:9
相关论文
共 21 条
[1]   Optimization of mechanical and electrical properties of TiN/Si3N4 material by agglomerates-microstructure-control [J].
Akimune, Y ;
Munakata, F ;
Ando, M ;
Okamoto, Y ;
Hirosaki, N .
JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1997, 105 (02) :122-125
[2]  
Bellosi A., 1992, Journal of the European Ceramic Society, V9, P83, DOI 10.1016/0955-2219(92)90049-J
[3]  
Choi BJ, 1998, J AM CERAM SOC, V81, P2191, DOI 10.1111/j.1151-2916.1998.tb02606.x
[4]   STRENGTH DISTRIBUTION IN COMMERCIAL SILICON-CARBIDE MATERIALS [J].
DUTTA, S .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1988, 71 (11) :C474-C479
[5]  
Fox DS, 1998, J AM CERAM SOC, V81, P945, DOI 10.1111/j.1151-2916.1998.tb02431.x
[6]   CREEP OF SILICON-NITRIDE TITANIUM NITRIDE COMPOSITES [J].
GOGOTSI, YG ;
GRATHWOHL, G .
JOURNAL OF MATERIALS SCIENCE, 1993, 28 (16) :4279-4287
[7]   DENSIFICATION, MICROSTRUCTURE AND PROPERTIES OF SI3N4-TI(C,N) COMPOSITES [J].
HERRMANN, M ;
BALZER, B ;
SCHUBERT, C ;
HERMEL, W .
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 1993, 12 (04) :287-296
[8]   High thermal conductivity in silicon nitride with anisotropic microstructure [J].
Hirao, K ;
Watari, K ;
Brito, ME ;
Toriyama, M ;
Kanzaki, S .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1996, 79 (09) :2485-2488
[9]   Microstructure, fracture behavior and mechanical properties of TiN/Si3N4 composites [J].
Huang, JL ;
Lee, MT ;
Lu, HH ;
Lii, DF .
MATERIALS CHEMISTRY AND PHYSICS, 1996, 45 (03) :203-210
[10]   MICROSTRUCTURE AND CHEMICAL-REACTION IN A SI3N4-TIC COMPOSITE [J].
HUANG, JL ;
CHIU, HL ;
LEE, MT .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (03) :705-710