Flow thermohydraulic characterization of hierarchical-manifold microchannel heat sink with uniform flow distribution

被引：62

作者：

Zhou, Jianhong ^{[1
]}

Chen, Xuemei ^{[1
]}

Zhao, Qi ^{[1
]}

Lu, Mingxiang ^{[1
]}

Hu, Dinghua ^{[1
]}

Li, Qiang ^{[1
]}

机构：

[1] Nanjing Univ Sci & Technol, Sch Energy & Power Engn, MIIT Key Lab Thermal Control Elect Equipment, Nanjing 210094, Peoples R China

来源：

APPLIED THERMAL ENGINEERING | 2021年 / 198卷

关键词：

Manifold microchannel; Flow distribution; Additive manufacturing; Single-phase; Subcooled flow boiling; PRESSURE-DROP; ELECTRONICS; EXCHANGER;

D O I：

10.1016/j.applthermaleng.2021.117510

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The manifold microchannel (MMC) heat sink has been used for thermal management of high heat flux electronics. Flow maldistribution among micmchannels is one of the major hindrances that affect the proper functioning of the typical-MMC (i.e., a coplanar design of the manifolds and the inlet/outlet ports) cooling system, which is attributed to the Z-shaped flow of fluid between the microchannels and the manifolds. Herein, a novel hierarchical-MMC heat sink with stacked configuration is proposed, which mitigates flow maldistribution by optimizing the flow path. First, the fluid flow and heat transfer characteristics of the typical-MMC and the hierarchical-MMC are compared through single-phase conjugate simulation. Next, experimental tests are performed on the hierarchical-MMC heat sink fabricated by Selective Laser Melting (SLM) technology under single-phase and subcooled flow boiling conditions. The numerical results indicated that the hierarchical-MMC exhibits a uniform flow distribution, and the difference of percentage of volumetric flow rate in the section plane of the parallel micmchannels is less than 5%. Compared with the typical-MMC, the total pressure drop and overall thermal resistance of the hierarchical-MMC are reduced by 28-32% and 7-13% at the volumetric flow rate of 0.12-1.17 L/min, respectively. Moreover, the experimental results verified the accuracy of the numerical simulation and the feasibility of fabricating the hierarchical-MMC through SLM technology. Under subcooled flow boiling condition, a heat dissipation of 450 W/cm(2) is achieved under a footprint area of 30 x 30 mm at the volumetric flow rate of 1 L/min. The maximum value of cooling coefficient of performance (COP) for hierarchical-MMC heat sink is obtained to be 19,480 at the volumetric flow rate of 0.6 L/min and heat flux of 260 W/cm(2).

引用

页数：18

共 43 条

[1] Heat transfer and pressure drop characteristics of a flat plate manifold microchannel heat exchanger in counter flow configuration [J].

Andhare, Rohit S. ;

Shooshtari, Amir ;

Dessiatoun, Serguei V. ;

Ohadi, Michael M. .

APPLIED THERMAL ENGINEERING, 2016, 96 :178-189

[2]

Cheng P., 2006, ADV HEAT TRANSFER, V39, P461, DOI DOI 10.1016/S0065-2717(06)39005-3

[3] Evaluation of Additively Manufactured Microchannel Heat Sinks [J].

Collins, Ivel L. ;

Weibel, Justin A. ;

Pan, Liang ;

Garimella, Suresh V. .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (03) :446-457

[4] A permeable-membrane microchannel heat sink made by additive manufacturing [J].

Collins, Ivel L. ;

Weibel, Justin A. ;

Pan, Liang ;

Garimella, Suresh, V .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 131 :1174-1183

[5] Numerical investigation of heat transfer in microchannel using inclined longitudinal vortex generator [J].

Datta, Aparesh ;

Sanyal, Dipankar ;

Das, Ajoy Kumar .

APPLIED THERMAL ENGINEERING, 2016, 108 :1008-1019

[6] Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions [J].

Drummond, Kevin P. ;

Back, Doosan ;

Sinanis, Michael D. ;

Janes, David B. ;

Peroulis, Dimitrios ;

Weibel, Justin A. ;

Garimella, Suresh V. .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 126 :1289-1301

[7] A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics [J].

Drummond, Kevin P. ;

Back, Doosan ;

Sinanis, Michael D. ;

Janes, David B. ;

Peroulis, Dimitrios ;

Weibel, Justin A. ;

Garimella, Suresh V. .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 117 :319-330

[8] Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips [J].

Escher, W. ;

Brunschwiler, T. ;

Michel, B. ;

Poulikakos, D. .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2010, 132 (08) :1-10

[9] An experimental study of two-phase pressure drop of acetone in triangular silicon micro-channels [J].

Gan, Yunhua ;

Xu, Jinliang ;

Yan, Yuying .

APPLIED THERMAL ENGINEERING, 2015, 80 :76-86

[10] Single phase laminar fluid flow and heat transfer in microchannel with cylindrical and parallelepiped micro-fins [J].

Gorasiya, Anil ;

Saha, Sandip K. .

HEAT AND MASS TRANSFER, 2019, 55 (03) :613-626

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