Investigations of femtosecond-nanosecond dual-beam laser ablation of dielectrics

被引：32

作者：

Lin, Cheng-Hsiang ^{[1
,2
]}

Rao, Zheng-Hua ^{[1
]}

Jiang, Lan ^{[3
]}

Tsai, Wu-Jung ^{[4
]}

Wu, Ping-Han ^{[4
]}

Chien, Chih-Wei ^{[4
]}

Chen, Shean-Jen ^{[2
]}

Tsai, Hai-Lung ^{[1
]}

机构：

[1] Missouri Univ Sci & Technol, Dept Mech & Aerosp Engn, Rolla, MO 65409 USA

[2] Natl Cheng Kung Univ, Dept Engn Sci, Tainan 701, Taiwan

[3] Beijing Inst Technol, Sch 3, Dept Mech & Automat Engn, Beijing 100081, Peoples R China

[4] Ind Technol Res Inst, ITRI S, Laser Applicat Technol Ctr, Tainan 73445, Taiwan

来源：

OPTICS LETTERS | 2010年 / 35卷 / 14期

基金：

中国国家自然科学基金;

关键词：

OPTICAL-BREAKDOWN; MULTIWAVELENGTH EXCITATION; MATERIAL REMOVAL; PULSE; SILICA;

D O I：

10.1364/OL.35.002490

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We have conducted experimental investigations for the micromachining of dielectrics (fused silica) using an integrated femtosecond (fs) and nanosecond (ns) dual-beam laser system at different time delays between the fs and ns pulses. We found that the maximum ablation enhancement occurs when the fs pulse is shot near the peak of the ns pulse envelope. Enhancements up to 13.4 times in ablation depth and 50.7 times in the amount of material removal were obtained, as compared to fs laser ablation alone. The fs pulse increases the free electron density and changes the optical properties of fused silica to have metallic characteristics, which increases the absorption of the ns laser energy. This study provides an opportunity for efficient micromachining of dielectrics. (C) 2010 Optical Society of America

引用

页码：2490 / 2492

页数：3

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