Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

被引：68

作者：

Schubert, A ^{[1
]}

Walter, H ^{[1
]}

Dudek, R ^{[1
]}

Michel, B ^{[1
]}

Lefranc, G ^{[1
]}

Otto, J ^{[1
]}

Mitic, G ^{[1
]}

机构：

[1] Fraunhofer Inst Reliabil & Microinject, D-13355 Berlin, Germany

来源：

INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS | 2001年

关键词：

D O I：

10.1109/ISAOM.2001.916562

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：129 / 134

页数：6

共 17 条

[1]

ARROWOOD R, HOT DEFORMATION 2 PH, P107

[2]

Biglari MH, 2000, ELECTRONICS GOES GREEN 2000 (PLUS): A CHALLENGE FOR THE NEXT MILLENNIUM, VOL 1, PROCEEDINGS, P73

[3]

Bird J.E., 1969, QUANTITATIVE RELATIO, P255

[4]

Darveaux R., 1995, Chap. 13, P379

[5]

FREAR DR, 1997, TMS FALL M OCT 29 NO

[6] DEFORMATION OF PB-SN EUTECTIC ALLOYS AT RELATIVELY HIGH-STRAIN RATES [J].

GRIVAS, D ;

MURTY, KL ;

MORRIS, JW .

ACTA METALLURGICA, 1979, 27 (05) :731-737

[7] Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints [J].

Hacke, PL ;

Sprecher, AF ;

Conrad, H .

JOURNAL OF ELECTRONIC MATERIALS, 1997, 26 (07) :774-782

[8]

Hacke PL., 1993, ASTM STP, V1186, P91

[9] Creep phenomena in lead-free solders [J].

Igoshev, VI ;

Kleiman, JI .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (02) :244-250

[10] TMA, DMA, DSC, and TGA of lead free solders [J].

Lau, JH ;

Chang, C .

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, :1339-1344

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