Effects of Threading Dislocation Density on the Gate Leakage of AlGaN/GaN Heterostructures for High Electron Mobility Transistors

被引:73
作者
Kaun, Stephen W. [1 ]
Wong, Man Hoi [2 ]
Dasgupta, Sansaptak [2 ]
Choi, Soojeong [1 ]
Chung, Roy [1 ]
Mishra, Umesh K. [2 ]
Speck, James S. [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93106 USA
[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
基金
美国国家科学基金会;
关键词
MOLECULAR-BEAM EPITAXY; SURFACE-MORPHOLOGY; GALLIUM NITRIDE; GAN; GROWTH; CARBON; 6H-SIC(0001); HEMTS; LAYER;
D O I
10.1143/APEX.4.024101
中图分类号
O59 [应用物理学];
学科分类号
摘要
AlGaN/GaN heterostructures were regrown on three semi-insulating GaN templates with threading dislocation densities of similar to 2 x 10(10), similar to 5 x 10(8), and similar to 5 x 10(7) cm(-2). Regrowths were carried out under Ga-rich conditions by plasma-assisted molecular beam epitaxy to determine the effects of threading dislocation density on leakage through Schottky contacts on the AlGaN/GaN heterostructures. A similar AlGaN/GaN heterostructure was directly grown on 4H-SiC under Ga-rich conditions for comparison with the regrown heterostructures. High electron mobility transistors were fabricated. Decreasing the threading dislocation density from similar to 2 x 10(10) to similar to 5 x 10(7) cm(-2) yielded up to a 45-fold decrease in the average reverse Schottky diode current at -10 V bias. (C) 2011 The Japan Society of Applied Physics
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页数:3
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