Characteristics of 600, 1200, and 3300 V Planar SiC-MOSFETs for Energy Conversion Applications

被引:68
作者
Imaizumi, Masayuki [1 ]
Miura, Naruhisa [2 ,3 ]
机构
[1] Mitsubishi Electr Corp, Power Device Works, Fukuoka 8190192, Japan
[2] Mitsubishi Electr Corp, Adv Technol Res & Dev Ctr, Amagasaki, Hyogo 6618661, Japan
[3] Future Power Elect Technol, Minato 1050012, Japan
关键词
Body diode; planar MOSFET; power module; reverse bias safe operating area (RBSOA); silicon carbide (SiC); switching loss; threshold voltage; THRESHOLD VOLTAGE; KV;
D O I
10.1109/TED.2014.2358581
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
SiC-MOSFETs provide superior performance for next generation power electronics systems. High threshold voltage 600 V SiC-MOSFETs were realized utilizing a reoxidation process, which drastically improves a tradeoff between an ON-resistance and a threshold voltage. Low-loss SiC-MOSFETs with a 1200 V/100-A rating have been developed. Using the developed SiC-MOSFETs, 1200 V/800-A high-power full SiC module with an ON-resistance as low as 2.9 m Omega at 150 degrees C was successfully fabricated. The high-power module markedly reduces power loss especially at high carrier frequency. Large-area 3300 V SiC-MOSFETs with an ON-resistance of 52 m Omega at 175 degrees C exhibit an adequate reverse bias safe operating area and 3300 V SiC-MOSFETs screened by applying a body diode current stress show stable characteristics under a continuous current through their body diode for 1000 h.
引用
收藏
页码:390 / 395
页数:6
相关论文
共 20 条
[1]  
[Anonymous], JPN J APPL PHYS
[2]  
[Anonymous], MITSUBISHI ELECT LAU
[3]  
[Anonymous], WORLDS 1 LOW ON RESI
[4]  
[Anonymous], MITSUBISHI ELECT LAU
[5]  
[Anonymous], P IEEE IEDM DEC
[6]  
[Anonymous], CREE RELEASES SILICO
[7]  
Bolotnikov A, 2012, PROC INT SYMP POWER, P389, DOI 10.1109/ISPSD.2012.6229103
[8]  
Furuhashi M, 2013, PROC INT SYMP POWER, P55, DOI 10.1109/ISPSD.2013.6694397
[9]  
Furukawa A, 2011, PROC INT SYMP POWER, P288, DOI 10.1109/ISPSD.2011.5890847
[10]   Switching characteristics of SiC-MOSFET and SBD power modules [J].
Imaizumi, M. ;
Tarui, Y. ;
Kinouchi, S. ;
Nakatake, H. ;
Nakao, Y. ;
Watanabe, T. ;
Fujihira, K. ;
Miura, N. ;
Takami, T. ;
Ozeki, T. .
SILICON CARBIDE AND RELATED MATERIALS 2005, PTS 1 AND 2, 2006, 527-529 :1289-+