Over 10 Gbps/ch compact active interposer module for high-speed and high-density chip level optical interconnects

被引：0

作者：

Mikawa, T ^{[1
]}

Furuyama, H ^{[1
]}

Hiramatsu, S ^{[1
]}

Kinoshita, M ^{[1
]}

Ibaragi, O ^{[1
]}

机构：

[1] Assoc Super Adv Elect Technol, ASET, Elect Syst Integrat Technol Res Dept, Musashino, Tokyo 1808585, Japan

来源：

2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2003年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：368 / 369

页数：2

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