Over 10 Gbps/ch compact active interposer module for high-speed and high-density chip level optical interconnects

被引：0
作者：
Mikawa, T [1 ]
Furuyama, H [1 ]
Hiramatsu, S [1 ]
Kinoshita, M [1 ]
Ibaragi, O [1 ]
机构：
[1] Assoc Super Adv Elect Technol, ASET, Elect Syst Integrat Technol Res Dept, Musashino, Tokyo 1808585, Japan
来源：
2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2003年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：368 / 369
页数：2
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