Automating Design of Voltage Interpolation to Address Process Variations

被引:1
作者
Brownell, Kevin M. [1 ]
Khan, Ali Durlov [2 ]
Wei, Gu-Yeon [1 ]
Brooks, David [1 ]
机构
[1] Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
[2] Harvard Univ, SEAS, Cambridge, MA 02138 USA
关键词
Post fabrication tuning; process variations; voltage interpolation; DIE-TO-DIE; OPTIMIZATION; VARIABILITY; FREQUENCY; LEAKAGE;
D O I
10.1109/TVLSI.2009.2034457
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Post-fabrication tuning provides a promising design approach to mitigate the performance and power overheads of process variation in advanced fabrication technologies. This paper explores design considerations and VLSI-CAD support for a recently proposed post-fabrication tuning knob called voltage interpolation. Successful implementation of this technique requires examination of the design tradeoffs between circuit tuning range and static power overheads within the synthesis flow of the design process, in addition to the implications of place and route. Results from the exploration of the scheme for a 64-core chip-multiprocessor machine using industrial-grade design blocks show that the scheme can be used to mitigate overhead arising from random and correlated within-die process variations. A design using voltage interpolation can match the nominal delay target with a 16% power cost, or for the same power budget, incur only a 13% delay overhead after variations.
引用
收藏
页码:383 / 396
页数:14
相关论文
共 29 条
  • [1] AGARWAL A, 2003, IEEE T COMPUT AID D, V22, P16
  • [2] AGARWAL K., 2007, 8 INT S QUALITY ELEC, P85
  • [3] [Anonymous], 2008, CAD SOC ENC
  • [4] Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration
    Bowman, KA
    Duvall, SG
    Meindl, JD
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2002, 37 (02) : 183 - 190
  • [5] Brownell Kevin, 2008, 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), P529, DOI 10.1109/ICCAD.2008.4681626
  • [6] Place and Route Considerations for Voltage Interpolated Designs
    Brownell, Kevin
    Khan, Ali Durlov
    Brooks, David
    Wei, Gu-Yeon
    [J]. ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2, 2009, : 594 - 600
  • [7] Variability driven gate sizing for binning yield optimization
    Davoodi, Azadeh
    Srivastava, Ankur
    [J]. 43RD DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2006, 2006, : 959 - +
  • [8] Standby and active leakage current control and minimization in CMOS VLSI circuits
    Fallah, F
    Pedraw, M
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2005, E88C (04): : 509 - 519
  • [9] *FAR TECHN CORP, 2008, UMC 0 13 MUM LOG COR
  • [10] Post silicon power/performance optimization in the presence of process variations using individual well-adaptive body biasing
    Gregg, Justin
    Chen, Tom W.
    [J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2007, 15 (03) : 366 - 376