SU-8 as a structural material for labs-on-chips and microelectromechanical systems

被引:203
作者
Abgrall, Patrick [1 ]
Conedera, Veronique [2 ]
Camon, Henri [2 ]
Gue, Anne-Marie [2 ]
Nguyen, Nam-Trung [1 ]
机构
[1] Nanyang Technol Univ, Singapore MIT Alliance Sch Mech & Aerosp Engn, Thermal & Fluids Res Lab N3B2C06, Singapore 639798, Singapore
[2] Univ Toulouse, CNRS, LAAS, Toulouse, France
关键词
lab-on-chip; microelectromechanical systems; microtechnologies; SU-8;
D O I
10.1002/elps.200700333
中图分类号
Q5 [生物化学];
学科分类号
071010 ; 081704 ;
摘要
Since its introduction in the nineties, the negative resist SU-8 has been increasingly used in micro- and nanotechnologies. SU-8 has made the fabrication of high-aspect ratio structures accessible to labs with no high-end facilities such as X-ray lithography systems or deep reactive ion etching systems. These low-cost techniques have been applied not only in the fabrication of metallic parts or molds, but also in numerous other micromachining processes. Its ease of use has made SU-8 to be used in many applications, even when high-aspect ratios are not required. Beyond these pattern transfer applications, SU-8 has been used directly as a structural material for microelectromechanical systems and microfluidics due to its properties such as its excellent chemical resistance or the low Young modulus. In contrast to conventional resists, which are used temporally, SU-8 has been used as a permanent building material to fabricate microcomponents such as cantilevers, membranes, and microchannels. SU-8-based techniques have led to new low-temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab-on-chip. First, this article aims to review the different techniques and provides guidelines to the use of SU-8 as a structural material. Second, practical examples from our respective labs are presented.
引用
收藏
页码:4539 / 4551
页数:13
相关论文
共 107 条
  • [1] Lab-on-chip technologies:: making a microfluidic network and coupling it into a complete microsystem -: a review
    Abgrall, P.
    Gue, A-M
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (05) : R15 - R49
  • [2] A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films
    Abgrall, P
    Lattes, C
    Conédéral, V
    Dollat, X
    Colin, S
    Gué, AM
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (01) : 113 - 121
  • [3] ABGRALL P, 2005, 1NT C MIN SYST CHEM
  • [4] ABGRALL P, 2005, INT C MICR EL MECH O, P40
  • [5] ABGRALL P, 2006, LAAS CNRS
  • [6] Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps
    Agirregabiria, M
    Blanco, FJ
    Berganzo, J
    Arroyo, MT
    Fullaondo, A
    Mayora, K
    Ruano-López, JM
    [J]. LAB ON A CHIP, 2005, 5 (05) : 545 - 552
  • [7] Fabrication and characterization of folded SU-8 suspensions for MEMS applications
    Bachmann, Daniel
    Schoeberle, Bernd
    Kuehne, Stphane
    Leiner, Yves
    Hierold, Christofer
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2006, 130 : 379 - 386
  • [8] Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications
    Bhusari, D
    Reed, HA
    Wedlake, M
    Padovani, AM
    Allen, SAB
    Kohl, PA
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (03) : 400 - 408
  • [9] PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics
    Bilenberg, B
    Nielsen , T
    Clausen, B
    Kristensen, A
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (06) : 814 - 818
  • [10] Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
    Blanco, FJ
    Agirregabiria, M
    Garcia, J
    Berganzo, J
    Tijero, M
    Arroyo, MT
    Ruano, JM
    Aramburu, I
    Mayora, K
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (07) : 1047 - 1056