Silicon Photonic Integrated Circuit for Co-packaging with Switch ASIC

被引：3

作者：

Fathololoumi, S. ^{[1
]}

Hui, D. ^{[1
]}

Jadhav, S. ^{[1
]}

Nguyen, K. ^{[1
]}

Sakib, M. N. ^{[1
]}

Li, Z. ^{[1
]}

Mahalingam, H. ^{[1
]}

Amiralizadeh, S. ^{[1
]}

Tang, N. N. ^{[1
]}

Frish, H. ^{[1
]}

Liao, L. ^{[1
]}

机构：

[1] Intel Corp, Silicon Photon Prod Div, 3600 Juliette Lane, Santa Clara, CA 95054 USA

来源：

SILICON PHOTONICS XVI | 2021年 / 11691卷

关键词：

integrated optoelectronics; optical fiber communication; silicon photonics; co-packaged optics;

D O I：

10.1117/12.2577314

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Data center IP traffic is doubling every 2.5 years, driving the need to scale connectivity bandwidth on a similar cadence. At higher data rates the electrical link reach shrinks but energy efficiency does not improve significantly. Co-packaging optics close to ASICs enables data throughput scaling by reducing the SERDES power and hence overall power due to shorter electrical channels. Despite the advantages, co-packaging optics next to electronics can be challenging. This paper reviews Intel's advancements in demonstrating industry's first fully operational Silicon Photonic integrated circuit co-packaged with switch ASICs, describing in detail component level, integrated photonic integrated circuit (PIC) level, and transceiver module level design and performance.

引用

页数：6

共 13 条

[1]

[Anonymous], 2018, DATACENTER CONNECTIV

[2] Integrated Silicon Photonics for High-Volume Data Center Applications [J].

Blum, Robert .

OPTICAL INTERCONNECTS XX, 2020, 11286

[3] Multi-Tb/s-per-Fiber Coherent Co-Packaged Optical Interfaces for Data Center Switches [J].

Buscaino, Brandon ;

Taylor, Brian D. ;

Kahn, Joseph M. .

JOURNAL OF LIGHTWAVE TECHNOLOGY, 2019, 37 (13) :3401-3412

[4]

FATHOLOLOUMI S, 2020, OFC NFOEC 2020 2020, P1

[5] 1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration [J].

Fathololoumi, Saeed ;

Hui, David ;

Jadhav, Susheel ;

Chen, Jian ;

Nguyen, Kimchau ;

Sakib, M. N. ;

Li, Z. ;

Mahalingam, Hari ;

Amiralizadeh, Siamak ;

Tang, Nelson N. ;

Potluri, Harinadh ;

Montazeri, Mohammad ;

Frish, Harel ;

Defrees, Reece A. ;

Seibert, Christopher ;

Krichevsky, Alexander ;

Doylend, Jonathan K. ;

Heck, John ;

Venables, R. ;

Dahal, A. ;

Awujoola, A. ;

Vardapetyan, A. ;

Kaur, Guneet ;

Cen, Min ;

Kulkarni, Vishnu ;

Islam, Syed S. ;

Spreitzer, R. L. ;

Garag, S. ;

Alduino, A. C. ;

Chiou, R. K. ;

Kamyab, L. ;

Gupta, S. ;

Xie, B. ;

Appleton, R. S. ;

Hollingsworth, S. ;

McCargar, S. ;

Akulova, Y. ;

Brown, K. M. ;

Jones, R. ;

Zhu, Daniel ;

Liljeberg, Thomas ;

Liao, Ling .

JOURNAL OF LIGHTWAVE TECHNOLOGY, 2021, 39 (04) :1155-1161

[6] Hybrid silicon integration [J].

Jones, R. ;

Park, H. D. ;

Fang, A. W. ;

Bowers, J. E. ;

Cohen, O. ;

Raday, O. ;

Paniccia, M. J. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2009, 20 :3-9

[7] Heterogeneously Integrated InP/Silicon Photonics Fabricating fully functional transceivers [J].

Jones, Richard ;

Doussiere, Pierre ;

Driscoll, Jeffrey B. ;

Lin, Wenhua ;

Yu, Haijiang ;

Akulova, Yulia ;

Komljenovic, Tin ;

Bowers, John E. .

IEEE NANOTECHNOLOGY MAGAZINE, 2019, 13 (02) :17-26

[8]

Kahn J. M, J LIGHTWAVE TECHNOL, DOI [10.1109/JLT.2020.3043653 (2021, DOI 10.1109/JLT.2020.3043653(2021]

[9]

Krishnamurthi, 2017, U.S. Patent, Patent No. [9 709 734, 9709734]

[10]

Kuchta D, 2019, 2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)

← 1 2 →