10 KNbN DSP module for IR sensor applications

被引：6

作者：

Sun, AG ^{[1
]}

Dalrymple, BJ ^{[1
]}

Durand, DJ ^{[1
]}

Herr, QP ^{[1
]}

Johnson, MW ^{[1
]}

Luine, JA ^{[1
]}

Spooner, A ^{[1
]}

机构：

[1] TRW Space & Elect Grp, Redondo Beach, CA 90278 USA

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2001年 / 11卷 / 01期

关键词：

digital signal processing (DSP); four-phase MVTL clocking; IR sensor; NbN directly-grounded-junction (DGJ); SFQ counting ADC;

D O I：

10.1109/77.919346

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The authors report significant progress on infrared (IR) focal plane array (FPA) imaging signal processing circuits, built in NbN and operating at 10 K. The improvements to our NbN process are highlighted by the introduction of directly grounded junctions (DGJ). These DGJs substantially reduce parasitic inductance thereby compensating for the high sheet inductance of NbN films. The circuits being developed include a 16-bit SFQ counting ADC and several digital signal processing (DSP) units. We report test results of greatly improved ADC performance, which is the result of both improved designs and fabrication techniques. Signal processing units on individual chips have been designed, fabricated, and tested. They perform functions such as background subtraction, gain and responsivity correction, and data reduction, We report test results of the DSP chips performing these functions. Ultimately, these chips will be integrated on a multi-chip-module (MCM) with high bandwidth, low impedance interconnects and integrated with an IR focal plane array sensor.

引用

页码：312 / 317

页数：6

共 8 条

[1] Superconductive multi-chip module process for high speed digital applications [J].