Experimental characterization of TSV liquid cooling for 3D integration

被引：0

作者：

Park, Manseok ^{[1
]}

Kim, Sungdong ^{[2
]}

Kim, Sarah Eunkyung ^{[1
]}

机构：

[1] Seoul Natl Univ Sci & Technol, Grad Sch NID Fus Technol, Seoul, South Korea

[2] Seoul Natl Univ Sci & Technol, Dept Mech Syst Design Engn, Seoul, South Korea

来源：

2015 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND 2015 IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE (IITC/MAM) | 2015年

关键词：

THROUGH-SILICON;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.

引用

页码：241 / 243

页数：3