Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component

被引:4
|
作者
Bairi, A. [1 ]
Velazquez, A. [2 ]
机构
[1] Univ Paris, Lab Therm Interfaces Environm LTIE, Ville Davray, France
[2] Univ Politecn Madrid, Fluid Mech & Aerosp Prop Dept, Madrid, Spain
关键词
Free convection; Engineering applications; Numerical approach; Thermal regulation; Finned vertical cylindrical electronic component; Water-copper nanofluid; HEAT-TRANSFER; ENCLOSURES; FLOW;
D O I
10.1108/HFF-03-2021-0158
中图分类号
O414.1 [热力学];
学科分类号
摘要
Purpose The purpose of this study is to quantify the free convective heat transfer around a vertical cylindrical electronic component equipped with vertical fins representing an antenna, contained in a closed cavity maintained isothermal. Its cooling is provided via a water-based copper nanofluid whose volume fraction varies between 0% and 10%. Its effective viscosity and thermal conductivity are determined with the Brinkman and Maxwell models. Design/methodology/approach The governing equation system has been solved by means of the volume control method based on the SIMPLE algorithm. Findings A Nusselt-Rayleigh correlation valid in the 3.32 x 10(5) - 6.74 x 10(7) Rayleigh number range is proposed. It allows the thermal sizing of the considered system used in high power electronics to ensure their correct operation in the worst conditions. Originality/value The proposed correlations are original and unpublished.
引用
收藏
页码:931 / 943
页数:13
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