New generation of SAW devices on advanced engineered substrates combining piezoelectric single crystals and Silicon

被引：28

作者：

Ballandras, S. ^{[1
]}

Courjon, E. ^{[1
]}

Bernard, F. ^{[1
]}

Laroche, T. ^{[1
]}

Clairet, A. ^{[1
]}

Radu, I ^{[2
]}

Huyet, I ^{[2
]}

Drouin, A. ^{[2
]}

Butaud, E. ^{[2
]}

机构：

[1] Frecnsys SAS, Besancon, France

[2] SOITEC, Bernin, France

来源：

PROCEEDINGS OF THE 2019 JOINT CONFERENCE OF THE IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM AND EUROPEAN FREQUENCY AND TIME FORUM (EFTF-IFCS 2019) | 2019年

关键词：

Piezo-On-Insulator; -; POI; Wafer bonding; SAW; Temperature stability; Small Insertion Losses; filters; sensors; LAYERS; LITAO3; WAFER;

D O I：

10.1109/fcs.2019.8855991

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper describes a new generation of composite substrates dedicated to advanced surface acoustic wave (SAW) devices. For very long years, SAW applications (filtering, resonators, sensing) have been developed on single crystal materials. A competition was still existing with layered substrates using poly-crystals which were never able to overcome standard solutions. The Piezoelectric-On-Insulator (POI) structure which combines highly coupled single crystals with Silicon offers today unique properties to revitalize SAW industry and to give it a major push towards the modern telecommunication competition. This paper resumes the main steps that yields the technique to this edge and puts in perspective the potential of this breakthrough technology.

引用

页数：6

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