Contact mechanisms and design principles for Schottky contacts to group-III nitrides

被引:82
作者
Mohammad, SN [1 ]
机构
[1] Howard Univ, Dept Elect & Comp Engn, Washington, DC 20059 USA
[2] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA
[3] USN, Res Lab, Div Elect Sci & Technol, Washington, DC 20375 USA
关键词
D O I
10.1063/1.1856226
中图分类号
O59 [应用物理学];
学科分类号
摘要
Contact mechanisms and design principles for Schottky contacts to group-III nitrides have been studied. These contacts, made generally by using simple principles and past experiences, suffer from serious drawbacks. The importance of various parameters such as surface morphology, surface treatment, metal/semiconductor interactions at the interface, thermal stability, minimization of doping by metal deposition and etching, elimination of edge electric field, etc., for them has been thoroughly investigated. Several design principles have been proposed. Both theoretical and experimental data have been presented to justify the validity of the proposed contact mechanisms and design principles. While theoretical calculations provide fundamental physics underlying heavy doping, leakage, etc., the experimental data provide verification of the contact mechanisms and design principles. The proposed principles are general enough to be applicable to most, if not all, Schottky contacts. (C) 2005 American Institute of Physics.
引用
收藏
页数:19
相关论文
共 57 条
  • [1] High temperature characteristics of AlGaN/GaN modulation doped field-effect transistors
    Aktas, O
    Fan, ZF
    Mohammad, SN
    Botchkarev, AE
    Morkoc, H
    [J]. APPLIED PHYSICS LETTERS, 1996, 69 (25) : 3872 - 3874
  • [2] The variation of ohmic contacts and surface characteristics on p-GaN induced by reactive ion etching
    Chang, KM
    Cheng, CC
    Chu, JY
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (07) : G367 - G369
  • [3] Thermal stability study of Ni/Ta n-GaN Schottky contacts
    Chen, GL
    Chang, FC
    Shen, KC
    Ou, J
    Chen, WH
    Lee, MC
    Chen, WK
    Jou, MJ
    Huang, CN
    [J]. APPLIED PHYSICS LETTERS, 2002, 80 (04) : 595 - 597
  • [4] Effects of thermal annealing on Ni/Ta/n-GaN Schottky diodes
    Chen, GL
    Chang, FC
    Chung, WC
    Huang, BR
    Chen, WH
    Lee, MC
    Chen, WK
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2001, 40 (3B): : L255 - L258
  • [5] Oxidized Ni/Pt and Ni/Au ohmic contacts to p-type GaN
    Chen, LC
    Ho, JK
    Jong, CS
    Chiu, CC
    Shih, KK
    Chen, FR
    Kai, JJ
    Chang, L
    [J]. APPLIED PHYSICS LETTERS, 2000, 76 (25) : 3703 - 3705
  • [6] Microstructural investigation of oxidized Ni/Au ohmic contact to p-type GaN
    Chen, LC
    Chen, FR
    Kai, JJ
    Chang, L
    Ho, JK
    Jong, CS
    Chiu, CC
    Huang, CN
    Chen, CY
    Shih, KK
    [J]. JOURNAL OF APPLIED PHYSICS, 1999, 86 (07) : 3826 - 3832
  • [7] High breakdown voltage Au/Pt/GaN Schottky diodes
    Dang, GT
    Zhang, AP
    Mshewa, MM
    Ren, F
    Chyi, JI
    Lee, CM
    Chuo, CC
    Chi, GC
    Han, J
    Chu, SNG
    Wilson, RG
    Cao, XA
    Pearton, SJ
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2000, 18 (04): : 1135 - 1138
  • [8] Very low resistance multilayer ohmic contact to n-GaN
    Fan, ZF
    Mohammad, SN
    Kim, W
    Aktas, O
    Botchkarev, AE
    Morkoc, H
    [J]. APPLIED PHYSICS LETTERS, 1996, 68 (12) : 1672 - 1674
  • [9] METAL CONTACTS TO GALLIUM NITRIDE
    FORESI, JS
    MOUSTAKAS, TD
    [J]. APPLIED PHYSICS LETTERS, 1993, 62 (22) : 2859 - 2861
  • [10] Schottky contact and the thermal stability of Ni on n-type GaN
    Guo, JD
    Pan, FM
    Feng, MS
    Guo, RJ
    Chou, PF
    Chang, CY
    [J]. JOURNAL OF APPLIED PHYSICS, 1996, 80 (03) : 1623 - 1627