Digital image correlation of metal nanofilms on SU-8 for flexible electronics and MEMS

被引:11
作者
Roland, Thierry [1 ,2 ]
Arscott, Steve [3 ]
Sabatier, Laurent [2 ]
Buchaillot, Lionel [3 ]
Charkaluk, Eric [2 ]
机构
[1] INSA Strasbourg, ICS, CNRS, UPR 22, F-67084 Strasbourg, France
[2] Ecole Cent Lille, LML, CNRS, UMR 8107, F-59651 Villeneuve Dascq, France
[3] IEMN, CNRS, UMR 8520, NAM6, F-59652 Villeneuve Dascq, France
关键词
X-RAY-DIFFRACTION; THIN-FILMS; MECHANICAL-PROPERTIES; INTEGRATED-CIRCUITS; ELASTIC PROPERTIES; SIZE; NANOCRYSTALLINE; MICROELECTRODES; DEFORMATION; MICROSCOPY;
D O I
10.1088/0960-1317/21/12/125005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents strain measurements using digital image correlation of common microelectronic metal nanofilms deposited onto a polymer substrate (SU-8), which has applications in flexible electronics and nano/microsystems reliability analysis. The novel experimental method is based on digital image correlation coupled with microtensile test apparatus for the in situ investigation of the deformation behaviour of the deposited thin films under uniaxial tensile loading. One of the key features of the method is the real-time two-dimensional strain field measurements on a bare thin film surface, during the deformation process, without any initial speckle or grid deposition. The outstanding performances of the method, having a spatial resolution of 0.7 mu m, allow one to envisage further studies related to the understanding of the mechanical behaviour of such thin films and, in particular, the damage localization process.
引用
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页数:8
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