共 11 条
- [1] *BPA CONS LTD, 762 BPA CONS LTD
- [2] DAELE PV, 2003, P 53 EL COMP TECHN C, P1140
- [3] SMY-compatible large-tolerance "OptoBump" interface for interchip optical interconnections [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (02): : 122 - 127
- [5] Polymeric waveguides on rigid and flexible PCB [J]. 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1947 - 1951
- [7] Mohammed E., 2004, Intel Technology Journal
- [8] Optical I/O technology for digital VLSI [J]. PHOTONICS PACKAGING AND INTEGRATION IV, 2004, 5358 : 60 - 70
- [9] Planar glass waveguides for high performance Electrical-Optical-Circuit-Boards (EOCB) -: The glass-layer-concept [J]. 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1053 - 1059
- [10] SHEN LC, 2004, P 6 EL PACK TECHN C