Flexible electronic-optical local bus modules to the board-to-board, board-to-chip, and chip-to-chip optical interconnection

被引:0
|
作者
Shen, LC [1 ]
Lo, WC [1 ]
Chang, HH [1 ]
Fu, HC [1 ]
Lee, YC [1 ]
Chang, SM [1 ]
Chen, YC [1 ]
Chen, WY [1 ]
机构
[1] Ind Technol Res Inst, Adv Packaging Technol Ctr, Hsinchu, Taiwan
关键词
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a flexible active E/O local bus module using multi-mode optical transmission is proposed to perform board-to-board, chip-to-chip, or board-to-chip optical interconnection with compatibility to traditionally electrical interfaces. In this proposed scheme, high speed modules or chips on tradition printed circuit board (PCB) can be directly interconnected through a flexible active E/O cable which can actively convert high speed signals to/from optical forms and then transmit optical signals through the optical waveguide layer. A 17-cm long prototyping of the proposed E/O local bus module is developed here to demonstrate the feasibility of short reach optical interconnection in board level applications.
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页码:1039 / 1043
页数:5
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