Thermal stress analysis of MCM package using diamond material

被引：0

作者：

Xie, Kuo-jun ^{[1
]}

Jiang, Chang-shun ^{[1
]}

Zhu, Lin ^{[1
]}

Xu, Hai-feng ^{[1
]}

机构：

[1] Univ Elect Sci & Technol China, Sch Phys Elect, Chengdu 610054, Peoples R China

来源：

PROGRESSES IN FRACTURE AND STRENGTH OF MATERIALS AND STRUCTURES, 1-4 | 2007年 / 353-358卷

关键词：

diamond substrate; finite element method; thermal stress;

D O I：

10.4028/www.scientific.net/KEM.353-358.2904

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and more temperature distributions and problems about thermal stresses in package. In this paper a finite element thermal stress model of substrate-adhesive-chip is established, thermal stress distribution of substrate-chip interfaces and the affects of geometrical structure on thermal stresses are analyzed by finite element method, especially discuss interfacial thermal stresses distributions on chip-adhesive interface and adhesinve-substrate interface.

引用

页码：2904 / 2907

页数：4