Macro-particle reduction mechanism in biased arc ion plating of TiN

被引:100
作者
Huang, MD
Lin, GQ
Zhao, YH
Sun, C
Wen, LS
Dong, CA [1 ]
机构
[1] Dalian Univ Technol, Dept Mat Engn, State Key Lab Mat Modificat, Dalian 116204, Peoples R China
[2] Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
基金
中国国家自然科学基金;
关键词
arc evaporation; ion plating; pulsed; TiN; macro-particles;
D O I
10.1016/S0257-8972(03)00017-3
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The mechanism of macro-particles (MPs) contamination in arc ion plating is investigated on TiN films under different biases. The effect of the biases is analyzed from the viewpoint of plasma physics. It is shown that the negatively charged MPs are affected by the biases through a repulsive force from the negatively biased substrate. They are more easily charged by electrons under pulsed biases because they repeatedly move in and out of the oscillating plasma sheath. In d.c. bias modes, the plasma sheath is stable and its charging effect is weak. Thus the repulsive force from the substrate under the pulsed biases is higher than that under the d.c. ones, and therefore, MPs are significantly reduced. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:109 / 114
页数:6
相关论文
共 26 条
[1]   A STUDY OF THE MACROPARTICLE DISTRIBUTION IN CATHODIC-ARC-EVAPORATED TIN FILMS [J].
BAOUCHI, AW ;
PERRY, AJ .
SURFACE & COATINGS TECHNOLOGY, 1991, 49 (1-3) :253-257
[2]   CHARGING OF DUST GRAINS IN A PLASMA [J].
BARKAN, A ;
DANGELO, N ;
MERLINO, RL .
PHYSICAL REVIEW LETTERS, 1994, 73 (23) :3093-3096
[3]   Nonequilibrium macroparticle charging in low-density discharge plasmas [J].
Beilis, II ;
Keidar, M ;
Boxman, RL ;
Goldsmith, S .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 1997, 25 (02) :346-352
[4]   MACROPARTICLE CONTAMINATION IN CATHODIC ARC COATINGS - GENERATION, TRANSPORT AND CONTROL [J].
BOXMAN, RL ;
GOLDSMITH, S .
SURFACE & COATINGS TECHNOLOGY, 1992, 52 (01) :39-50
[5]   THE INTERACTION BETWEEN PLASMA AND MACROPARTICLES IN A MULTI-CATHODE-SPOT VACUUM-ARC [J].
BOXMAN, RL ;
GOLDSMITH, S .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (01) :151-161
[6]   Dust charge in the sheath of collisional low-pressure capacitive RF discharges [J].
Chen, XP .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 1997, 25 (05) :1117-1123
[7]   Thermal analysis of macroparticles during vacuum arc deposition of TiN [J].
Cheng, ZY ;
Wang, M ;
Zou, JY .
SURFACE & COATINGS TECHNOLOGY, 1997, 92 (1-2) :50-55
[8]   CATHODIC ARC DEPOSITION OF TIN AND ZR(C,N) AT LOW SUBSTRATE TEMPERATURES USING A PULSED BIAS VOLTAGE [J].
FESSMANN, J ;
OLBRICH, W ;
KAMPSCHULTE, G ;
EBBERINK, J .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1991, 140 :830-837
[9]   CATHODE POISONING DURING REACTIVE ARC EVAPORATION OF TITANIUM IN NITROGEN ATMOSPHERE [J].
HOVSEPIAN, P ;
POPOV, D .
VACUUM, 1994, 45 (05) :603-607
[10]   Macroparticle interaction with a substrate in cathodic vacuum arc deposition [J].
Keidar, M ;
Beilis, I ;
Boxman, RL ;
Goldsmith, S .
SURFACE & COATINGS TECHNOLOGY, 1996, 86 (1-3) :415-420