Electrorheological tactel elements

被引:25
作者
Klein, D
Freimuth, H
Monkman, GJ
Egersdörfer, S
Meier, A
Böse, H
Baumann, M
Ermert, H
Bruhns, OT
机构
[1] Fachhsch Regensburg, Fachbereich Elektrotech, D-93053 Regensburg, Germany
[2] Inst Mikrotech Mainz, Mainz, Germany
[3] Fraunhofer Inst Silicatforsch, Wurzburg, Germany
[4] Ruhr Univ Bochum, D-4630 Bochum, Germany
关键词
D O I
10.1016/j.mechatronics.2004.05.007
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The use of ultrasound systems for medical examination and diagnosis is nothing new. The extension of ultrasound techniques for real time elastographic analysis purposes represents a more recent development. Nevertheless, as they stand all such techniques rely on the interpretation of two-dimensional visual data displayed on a video screen. In reality however, a medical doctor will make as much use of exploratory touch as he or she does vision, making the simultaneous portrayal of both video and tactile information most desirable [Bose H, Monkman GJ, Freimuth H, Ermert H. Haptisches Sensor-Aktor-System uaf der grundlage der Echtzeitelastographie sowie von elktro- und magnetorheologischen Materialien "HASASEM" [3]. BMBF Antrag 01 IR A14D, Oktober 2000]. This paper discusses the preliminary tests and basic design parameters for single tactels using electrorheological fluids. The final aim is to produce a prototype three-dimensional tactile display comprising electrically switchable micro-machined cells whose mechanical moduli are governed by phase changes experienced by electrorheological fluids. This will be integrated with the latest elastographic ultrasonic sensor systems in order to present the human fingers with controllable surfaces capable of emulating biological tissue, muscle and bone. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:883 / 897
页数:15
相关论文
共 21 条
[1]  
*BAYER SIL, PROV PROD INF RHEOB
[2]  
BLISS J, 1970, IEEE T MAN MACHINE S, V11
[3]  
BOSE H, 2002, 8 INT C NEW ACT BREM, P351
[4]  
BOSE H, 2000, A14D BMBF IR
[5]  
DUMARGUE G, 1987, Patent No. 2586660
[6]  
FELICI N, 1984, P 4 INT C EL FLUIDS, P139
[7]   Etching through silicon wafer in inductively coupled plasma [J].
Franssila, S ;
Kiihamäki, J ;
Karttunen, J .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2000, 6 (04) :141-144
[8]  
FRICKE J, 1991, Patent No. 048187
[9]  
KLEIN D, IN PRESS J PHYS D
[10]  
Kong S., 1997, Transactions of the Institute of Electrical Engineers of Japan, Part E, V117-E, P10, DOI 10.1541/ieejsmas.117.10