Source/Drain Engineering for In0.7Ga0.3As N-Channel Metal-Oxide-Semiconductor Field-Effect Transistors. Raised Source/Drain with In situ Doping for Series Resistance Reduction

被引:8
作者
Gong, Xiao [1 ,2 ]
Chin, Hock-Chun [1 ]
Koh, Shao-Ming [1 ]
Wang, Lanxiang [1 ,2 ]
Ivana [1 ,2 ]
Zhu, Zhu [1 ]
Wang, Benzhong [3 ]
Chia, Ching Kean [3 ]
Yeo, Yee-Chia [1 ,2 ]
机构
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore
[2] Natl Univ Singapore, NUS Grad Sch Integrat Sci & Engn, Singapore 117456, Singapore
[3] Agcy Sci Technol & Res, Inst Mat Res & Engn, Singapore 117602, Singapore
基金
新加坡国家研究基金会;
关键词
AMMONIA SURFACE PASSIVATION; HIGH-PERFORMANCE; GATE; MOSFETS; STACK; TECHNOLOGY;
D O I
10.1143/JJAP.50.04DF01
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this paper, we report N-channel metal-oxide-semiconductor field-effect transistors (N-MOSFETs) featuring in situ doped raised In0.53Ga0.47As source/drain (S/D) regions. This is the first demonstration of such regrowth on an In0.7Ga0.3As channel. After SiON spacer formation, the raised In0.53Ga0.47As S/D structure was formed by selective epitaxy of In0.53Ga0.47As in the S/D regions by metal-organic chemical-vapor deposition (MOCVD). In situ silane SiH4 doping was also introduced to boost the N-type doping concentration in the S/D regions for series resistance R-SD reduction. The raised S/D structure contributes to I-Dsat enhancement for the In0.7Ga0.3As N-MOSFETs. (C) 2011 The Japan Society of Applied Physics
引用
收藏
页数:4
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