The application of thiol-ene reaction on preparing UV curable bismaleimide-containing liquid formulations

被引：20

作者：

Fan, Shiliang ^{[1
,2
]}

Boey, Freddy Y. C. ^{[2
]}

Abadie, Marc J. M. ^{[1
,2
]}

机构：

[1] Univ Montpellier 2, LEMP, MAO, F-34095 Montpellier, France

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

来源：

EUROPEAN POLYMER JOURNAL | 2008年 / 44卷 / 07期

关键词：

bismaleimide; photopolymerization; DPC; kinetics; thiol-ene; formulation;

D O I：

10.1016/j.eurpolymj.2008.04.024

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Thiol-ene reaction method was introduced to photopolymerize a new liquid formulation of commercial bismaleimide, as an alternative to traditional thermal cure method presently used for BMI in the industry. UV curing was shown to be an efficient method which promoted the reaction rate significantly and was able to achieve this at low temperatures (30-50 degrees C). The liquid formulation is stable and has low viscosity. The cure mechanism and cure kinetics were studied based on the data elucidated from the DPC and FTIR. The cured thin film can achieve very high thermal stability (similar to 400 degrees C) and BMI can retard the thermal degradation temperature and rate. Crown Copyright (C) 2008 Published by Elsevier Ltd. All rights reserved.

引用

页码：2123 / 2129

页数：7

共 18 条

[11]

2-E

[12] DETERMINATION OF AUTOCATALYTIC KINETIC-MODEL PARAMETERS DESCRIBING THERMOSET CURE [J].

KENNY, JM .

JOURNAL OF APPLIED POLYMER SCIENCE, 1994, 51 (04) :761-764

[13]

KLEMM E, 1991, J MAKROMOL CHEM, V192, P2895

[14]

*LIQ MOULD TECHN, 1997, RES TRANSF MOULD STR

[15] RHEOLOGICAL CHANGES DURING CROSSLINKING [J].

MACOSKO, CW .

BRITISH POLYMER JOURNAL, 1985, 17 (02) :239-245

[16] Michael addition reactions in macromolecular design for emerging technologies [J].

Mather, Brian D. ;

Viswanathan, Kalpana ;

Miller, Kevin M. ;

Long, Timothy E. .

PROGRESS IN POLYMER SCIENCE, 2006, 31 (05) :487-531

[17] Effect of layered nano-organosilicate on the gel point rheology of bismaleimide/diallylbisphenol A resin [J].

Meng, JR ;

Hu, X ;

Boey, FYC ;

Li, L .

POLYMER, 2005, 46 (08) :2766-2776

[18]

Sestak J., 1971, THERMOCHIM ACTA, V3, P1, DOI [DOI 10.1016/0040-6031(71)85051-7, 10.1016/0040-6031(71)85051-7]

← 1 2 →