Effect of Solidification Conditions on Partial Melt Processed Bi2212/Ag Round Wire

被引：11

作者：

Nachtrab, W. T. ^{[1
]}

Liu, X. T. ^{[2
]}

Wong, T. ^{[1
]}

Schwartz, J. ^{[2
]}

机构：

[1] Supercon Inc, Shrewsbury, MA 01545 USA

[2] N Carolina State Univ, Raleigh, NC 27695 USA

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2011年 / 21卷 / 03期

关键词：

Bi2212/Ag round wire; high-temperature superconductors; partial melt processing; wires; CRITICAL-CURRENT-DENSITY; SUPERCONDUCTING PROPERTIES; MICROSTRUCTURE; TEMPERATURE; IMPROVEMENT;

D O I：

10.1109/TASC.2010.2099194

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher I-c compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on than the initial cooling rate.

引用

页码：2795 / 2799

页数：5

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