Effect of Solidification Conditions on Partial Melt Processed Bi2212/Ag Round Wire

被引：11
作者：
Nachtrab, W. T. [1 ]
Liu, X. T. [2 ]
Wong, T. [1 ]
Schwartz, J. [2 ]
机构：
[1] Supercon Inc, Shrewsbury, MA 01545 USA
[2] N Carolina State Univ, Raleigh, NC 27695 USA
来源：
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2011年 / 21卷 / 03期
关键词：
Bi2212/Ag round wire; high-temperature superconductors; partial melt processing; wires; CRITICAL-CURRENT-DENSITY; SUPERCONDUCTING PROPERTIES; MICROSTRUCTURE; TEMPERATURE; IMPROVEMENT;
D O I：
10.1109/TASC.2010.2099194
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher I-c compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on than the initial cooling rate.
引用
收藏
页码：2795 / 2799
页数：5
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