SIMULTANEOUS SWITCHING NOISE ENABLER IN HIGH-SPEED BIOMEDICAL SYSTEMS BY INTEGRATED PLANE COUPLING

被引:0
|
作者
Singh, Surender [1 ]
Agarwal, Ravinder [1 ]
Singh, V. R. [2 ]
机构
[1] Thapar Univ, Patiala 147004, Punjab, India
[2] PDM Grp Inst, Bahadurgarh, Haryana, India
关键词
electromagnetic interference; printed circuit board and power supply distribution network; simultaneous switching noise; SIGNAL INTEGRITY; POWER; REDUCTION; EMC; BUS;
D O I
10.1080/10739149.2015.1017767
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
The performance of high-speed biomedical systems is adversely affected by switching noise caused by inductance in the power supply distribution network. In a high-speed medical system, signals are switched at rates up to 5 Gbps and discrete capacitors are ineffective in reducing the noise at this rate. The noise may affect patient care. Integrated plane coupling effectively minimized simultaneous switching noise by creating high capacitance between the planes. Although the suppression of electromagnetic interference due to switching noise on the component and printed circuit board is difficult, the integrated plane coupling at the front-end of the design cycle was shown to eliminate noise. The effect of switching noise coupling was investigated and a solution is reported. A test board was analyzed and the results were compared with simulations. This approach was shown to be effective in minimizing switching noise in high-speed biomedical systems.
引用
收藏
页码:497 / 510
页数:14
相关论文
共 50 条
  • [1] Simultaneous Switching Noise Analysis for High-Speed Interface
    Takahashi, Narimasa
    Kagawa, Kenji
    Honda, Yutaka
    Takahashi, Yo
    IEICE TRANSACTIONS ON ELECTRONICS, 2009, E92C (04): : 460 - 467
  • [2] Modeling of simultaneous switching noise in high speed systems
    Chun, S
    Swaminathan, M
    Smith, LD
    Srinivasan, J
    Jin, Z
    Iyer, MK
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (02): : 132 - 142
  • [3] Power Plane Noise Coupling To High Speed Signals
    Demuynck, Filip
    Eichinger, Ludwig
    Poisson, Vincent
    2015 IEEE 19TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2015,
  • [4] Minimizing Simultaneous Switching Noise at Reduced Power with Power Transmission Lines for High-Speed Signaling
    Telikepalli, Satyanarayana
    Swaminathan, Madhavan
    Keezer, David
    2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 29 - 32
  • [5] ESTIMATION METHOD FOR SIMULTANEOUS SWITCHING NOISE IN POWER DELIVERY NETWORK FOR HIGH-SPEED DIGITAL SYSTEM DESIGN
    Ding, T. -H.
    Li, Y. -S.
    Jiang, D. -C.
    Qu, Y. -Z.
    Yan, X.
    PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER, 2012, 125 : 79 - 95
  • [6] New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design
    Eo, Y
    Eisenstadt, WR
    Jeong, JY
    Kwon, OK
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 303 - 312
  • [7] Partial EBG Structure with DeCap for Ultra-wideband Suppression of Simultaneous Switching Noise in a High-Speed System
    Kwon, Jong Hwa
    Kwak, Sang Il
    Sim, Dong-Uk
    Yook, Jong-Gwan
    ETRI JOURNAL, 2010, 32 (02) : 265 - 272
  • [8] Minimizing Simultaneous Switching Noise at Reduced Power with Constant-Voltage Power Transmission Lines for High-Speed Signaling
    Telikepalli, Satyanarayana
    Swaminathan, Madhavan
    Keezer, David
    PROCEEDINGS OF THE FOURTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2013), 2013, : 714 - 718
  • [9] Mitigation of simultaneous switching noise in high speed circuit using electromagnetic bandgap structures with interdigial meander bridge
    Hung, Kuo-Chiang
    Lin, Ding-Bing
    Wu, Chun-Te
    Wu, Leon
    2007 6TH INTERNATIONAL CONFERENCE ON INFORMATION, COMMUNICATIONS & SIGNAL PROCESSING, VOLS 1-4, 2007, : 694 - +
  • [10] Meander-DGS Effect on Electromagnetic Bandgap Structure for Power/Ground Noise Suppression in High-Speed Integrated Circuit Packages and PCBs
    Kim, Myunghoi
    ELECTRONICS, 2022, 11 (02)