Thermoelectric coolers for on-chip thermal management: Materials, design, and optimization

被引:194
作者
Chen, Wen-Yi [1 ]
Shi, Xiao-Lei [2 ]
Zou, Jin [1 ,3 ]
Chen, Zhi-Gang [2 ]
机构
[1] Univ Queensland, Sch Mech & Ming Engn, Brisbane, Qld 4072, Australia
[2] Queensland Univ Technol, Sch Chem & Phys, Brisbane, Qld 4000, Australia
[3] Univ Queensland, Ctr Microscopy & Microanal, Brisbane, Qld 4072, Australia
基金
澳大利亚研究理事会;
关键词
Thermoelectric; Cooler; Chip; Thermal management; Materials; THIN-FILMS; PERFORMANCE; FABRICATION; DEVICES; GENERATION;
D O I
10.1016/j.mser.2022.100700
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Compared with traditional active cooling methods, thermoelectric coolers are more accessible to be integrated with electronics as an effective thermal management solution due to their reliability, silence, compatibility, and controllability. Considering the rapid development of processors and chips in electronics, this work compre-hensively reviews the progress of state-of-the-art on-chip thermoelectric coolers and summarizes the related fundamentals, materials, designs, and system logic. Particularly, we highlight on-chip thermoelectric coolers with self-cooling design and on-demand requirement. In the end, we point out current challenges and oppor-tunities for future improvement of designs, performance, and applications of on-chip thermoelectric coolers.
引用
收藏
页数:19
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