Atomistic tight-binding calculations for the investigation of transport in extremely scaled SOI transistors

被引:0
作者
Städele, M [1 ]
Di Carlo, A [1 ]
Lugli, P [1 ]
Sacconi, F [1 ]
Tuttle, B [1 ]
机构
[1] Infineon Technol AG, Corp Res, D-81739 Munich, Germany
来源
2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST | 2003年
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中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper reviews the basic methodology and highlights advantages and recent applications of atomistic tight-binding calculations for the investigation of carrier transport in extremely scaled SOI transistors. The calculations yield numerous insights into direct and defect-assisted gate oxide tunneling, source-drain transport and tunneling, subband coupling, and carrier quantization in ultrathin-body devices with (possibly strained) Si and SiGe channels. The present results are in very good agreement with the available experimental data and document limitations of the standard effective-mass-based schemes.
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页码:229 / 232
页数:4
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