Temperature dependence of surface plasmon and breakdown for thin and thick silicon-dioxide

被引:0
|
作者
Kim, JH [1 ]
Sanchez, JJ [1 ]
DeMassa, TA [1 ]
Quddus, MT [1 ]
Grondin, RO [1 ]
Liu, CH [1 ]
机构
[1] Arizona State Univ, Dept Elect Engn, Tempe, AZ 85287 USA
关键词
D O I
10.1016/S0038-1101(98)00196-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The anode hole injection oxide breakdown model based upon surface plasmons is presented. The increase in conductance at bias voltages near the surface plasmon energy is observed on metal-oxide-semiconductor capacitors. The surface plasmon excitation threshold energy decreases with increasing temperature which causes the positive charge generation to increase and the charge to breakdown to decrease. Therefore, the anode hole injection model based upon surface plasmons is a reasonable thin oxide breakdown model that confirms experimental observations. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:57 / 63
页数:7
相关论文
共 50 条
  • [1] Surface plasmons and breakdown in thin silicon dioxide films on silicon
    Kim, JH
    Sanchez, JJ
    DeMassa, TA
    Quddus, MT
    Smith, D
    Shaapur, F
    Weiss, K
    Liu, CH
    JOURNAL OF APPLIED PHYSICS, 1998, 84 (03) : 1430 - 1438
  • [2] The influence of elevated temperature on degradation and lifetime prediction of thin silicon-dioxide films
    Kaczer, B
    Degraeve, R
    Pangon, N
    Groeseneken, G
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (07) : 1514 - 1521
  • [3] DEEP-DEPLETION BREAKDOWN VOLTAGE OF SILICON-DIOXIDE SILICON MOS CAPACITORS
    RUSU, A
    BULUCEA, C
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (03) : 201 - 205
  • [4] ANNEALING-TEMPERATURE DEPENDENCE OF THE THERMAL-CONDUCTIVITY OF LPCVD SILICON-DIOXIDE LAYERS
    GOODSON, KE
    FLIK, MI
    SU, LT
    ANTONIADIS, DA
    IEEE ELECTRON DEVICE LETTERS, 1993, 14 (10) : 490 - 492
  • [5] The formation, imaging, and application of thin silicon-dioxide membrane
    Sugino, Rinji
    Ito, Takashi
    ELECTROCHIMICA ACTA, 2009, 54 (25) : 5998 - 6002
  • [6] ULTRA-THIN SILICON-DIOXIDE BREAKDOWN CHARACTERISTICS OF MOS DEVICES WITH N + AND P + POLYSILICON GATES.
    Holland, S.
    Chen, I.C.
    Hu, Chenming
    Electron device letters, 1987, EDL-8 (12): : 572 - 575
  • [7] ULTRA-THIN SILICON-DIOXIDE BREAKDOWN CHARACTERISTICS OF MOS DEVICES WITH N+ AND P+ POLYSILICON GATES
    HOLLAND, S
    CHEN, IC
    HU, CM
    IEEE ELECTRON DEVICE LETTERS, 1987, 8 (12) : 572 - 575
  • [8] Charging and intrinsic-leakage current peaks in thin silicon-dioxide films
    Yamada, R
    Yugami, J
    Ohkura, M
    1997 SYMPOSIUM ON VLSI TECHNOLOGY: DIGEST OF TECHNICAL PAPERS, 1997, : 147 - 148
  • [9] Low temperature high quality growth of silicon-dioxide using oxygenation of hydrogenation-assisted nano-structured silicon thin films
    Rouhi, Nima.
    Esfandyarpour, Behzad
    Mohajerzadeh, Shams
    Hashemi, Pouya
    Hekmat-Shoar, Bahman
    Robertson, Michael D.
    AMORPHOUS AND POLYCRYSTALLINE THIN-FILM SILICON SCIENCE AND TECHNOLOGY 2007, 2007, 989 : 95 - +
  • [10] Breakdown of thin gate silicon dioxide films - a review
    Universitat Autonoma de Barcelona, Bellaterra, Spain
    Microelectron Reliab, 7-8 (871-905):