共 50 条
- [36] Interfacial Stress Prediction of Tri-layer Packaging with Void in Adhesive SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019), 2019,
- [40] A tri-layer approach to controlling nanopore formation in oxide supports Nano Research, 2019, 12 : 1223 - 1228