Spatial carrier color digital speckle pattern interferometry for absolute three-dimensional deformation measurement

被引:20
作者
Gao, Xinya [1 ]
Wang, Yonghong [1 ]
Li, Junrui [2 ]
Dan, Xizuo [1 ]
Wu, Sijin [3 ]
Yang, Lianxiang [1 ,2 ,3 ]
机构
[1] Hefei Univ Technol, Sch Instrument Sci & Optoelect Engn, Hefei, Anhui, Peoples R China
[2] Oakland Univ, Dept Mech Engn, Rochester, MI 48063 USA
[3] Beijing Informat Sci & Technol Univ, Dept Measurement Control Technol & Instrumentat, Beijing, Peoples R China
基金
中国国家自然科学基金;
关键词
absolute deformation; digital speckle pattern interferometry; spatial carrier; three-dimensional deformation; color camera; IMAGE CORRELATION;
D O I
10.1117/1.OE.56.6.066107
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
It is difficult to measure absolute three-dimensional deformation using traditional digital speckle pattern interferometry (DSPI) when the boundary condition of an object being tested is not exactly given. In practical applications, the boundary condition cannot always be specifically provided, limiting the use of DSPI in real-world applications. To tackle this problem, a DSPI system that is integrated by the spatial carrier method and a color camera has been established. Four phase maps are obtained simultaneously by spatial carrier color-digital speckle pattern interferometry using four speckle interferometers with different illumination directions. One out-of-plane and two in-plane absolute deformations can be acquired simultaneously without knowing the boundary conditions using the absolute deformation extraction algorithm based on four phase maps. Finally, the system is proved by experimental results through measurement of the deformation of a flat aluminum plate with a groove. (C) 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
引用
收藏
页数:7
相关论文
共 24 条
[1]   Use of spatial phase shifting technique in digital speckle pattern interferometry (DSPI) and digital shearography (DS) [J].
Bhaduri, Basanta ;
Mohan, N. Krishna ;
Kothiyal, M. P. ;
Sirohi, R. S. .
OPTICS EXPRESS, 2006, 14 (24) :11598-11607
[2]   Two wavelength simultaneous DSPI and DSP for 3D displacement field measurements [J].
Bhaduri, Basanta ;
Tay, C. J. ;
Quan, C. ;
Niu, H. ;
Sjodahl, Mikael .
OPTICS COMMUNICATIONS, 2011, 284 (10-11) :2437-2440
[3]  
Creath K., 1985, Proceedings of the SPIE - The International Society for Optical Engineering, V556, P337, DOI 10.1117/12.949561
[4]   Speckle interferometry: three-dimensional deformation field measurement with a single interferogram [J].
Fricke-Begemann, T ;
Burke, J .
APPLIED OPTICS, 2001, 40 (28) :5011-5022
[5]   Synchronous triple-optical-path digital speckle pattern interferometry with fast discrete curvelet transform for measuring three-dimensional displacements [J].
Gu, Guoqing ;
Wang, Kaifu ;
Wang, Yanfang ;
She, Bin .
OPTICS AND LASER TECHNOLOGY, 2016, 80 :104-111
[6]   TEMPORAL PHASE-UNWRAPPING ALGORITHM FOR AUTOMATED INTERFEROGRAM ANALYSIS [J].
HUNTLEY, JM ;
SALDNER, H .
APPLIED OPTICS, 1993, 32 (17) :3047-3052
[7]   Whole-field thickness strain measurement using multiple camera digital image correlation system [J].
Li, Junrui ;
Xie, Xin ;
Yang, Guobiao ;
Zhang, Boyang ;
Siebert, Thorsten ;
Yang, Lianxiang .
OPTICS AND LASERS IN ENGINEERING, 2017, 90 :19-25
[8]   Experimental study of FLD0 for aluminum alloy using digital image correlation with modified ISO method [J].
Li, Junrui ;
Xu, Wan ;
Xie, Xin ;
Siebert, Thorsten ;
Yang, Lianxiang .
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2016, 107 (03) :245-253
[9]   Recent developments in digital speckle pattern interferometry [J].
Mohan, NK ;
Rastogi, P .
OPTICS AND LASERS IN ENGINEERING, 2003, 40 (5-6) :439-445
[10]   Transient deformation measurement with electronic speckle pattern interferometry and a high-speed camera [J].
Moore, AJ ;
Hand, DP ;
Barton, JS ;
Jones, JDC .
APPLIED OPTICS, 1999, 38 (07) :1159-1162