Characterization of Phase Change Heat and Mass Transfers in Monoporous Silicon Wick Structures

被引:23
作者
Cai, Steve Q. [1 ]
Bhunia, Avijit [1 ]
机构
[1] Teledyne Sci & Image Co, Thousand Oaks, CA 91360 USA
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 2014年 / 136卷 / 07期
关键词
heat pipe; wick structure; phase change;
D O I
10.1115/1.4027152
中图分类号
O414.1 [热力学];
学科分类号
摘要
Silicon is the primary material of integrated circuit (IC) manufacturing in microelectronic industry. It has high thermal conductivity and superior thermomechanical properties compatible to most semiconductors. These characteristics make it an ideal material for fabricating micro/mini heat pipes and their wick structures. In this article, silicon wick structures, composed of cylindrical pillars 320 mu m in height and 30-100 mu m in diameter, are developed for studies of phase change capability. Fabrication of the silicon wick structures utilizes the standard microelectromechanical systems (MEMS) approach, which allows the precise definition on the wick dimensions, as well as the heated wick area. On these bases, experimental characterizations of temperature variations versus input heat fluxes, associated with simultaneous visualization on the liquid transport and the dryout, are performed to investigate the wick dimensional effects on the maximum phase change capability. On the wick structure with the pillar diameter/pores of 100 mu m and a heated wick area of 2 mm x 2 mm, the phase change reached a maximum heat flux of 1130 W/cm(2). Despite of the liquid bottom-feed approach, interactions between liquid and vapor phases enables the heated wick structure absorb liquid from its surrounding wick area, including from its top side with a longer liquid transport path. In contrast, a wick structure with fine pillars (10 mu m in diameter) inhibited the generation of nucleate boiling. Evaporation on the meniscus interface becomes the major phase change mechanism. A large heated wick area (4 mm x 4 mm) increases the viscous loss in transporting liquid to wet the entire wick, advancing the dryout at 135 W/cm(2). Mass transfer analysis, as well as discussion of the experimental results, indicates that a dimensional ratio r/l (pillar diameter/characteristic length of the heated wick area) is a key parameter in determining the maximum phase change capability. A low r/l ratio enhances heat and mass transport capability, as well as heat transfer coefficient.
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页数:8
相关论文
共 17 条
[1]   High heat flux phase change on porous carbon nanotube structures [J].
Cai, Qingjun ;
Bhunia, Avijit .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (21-22) :5544-5551
[2]   Design, development and tests of high-performance silicon vapor chamber [J].
Cai, Qingjun ;
Chen, Bing-chung ;
Tsai, Chialun .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (03)
[3]   Design and Test of Carbon Nanotube Biwick Structure for High-Heat-Flux Phase Change Heat Transfer [J].
Cai, Qingjun ;
Chen, Chung-Lung .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2010, 132 (05) :1-8
[4]   Experimental study of evaporative heat transfer in sintered copper bidispersed wick structures [J].
Cao, XL ;
Cheng, P ;
Zhao, TS .
JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2002, 16 (04) :547-552
[5]  
Faghri Amir., 1995, HEAT PIPE SCI TECHNO
[6]   Silicon heat pipes used as thermal spreaders [J].
Gillot, C ;
Avenas, Y ;
Cezac, N ;
Poupon, G ;
Schaeffer, C ;
Fournier, E .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (02) :332-339
[7]   Loop Heat Pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks [J].
Hamdan, M ;
Cytrynowicz, D ;
Medis, P ;
Shuja, A ;
Gerner, FM ;
Henderson, HT ;
Golliher, E ;
Mellott, K ;
Moore, C .
ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, :457-465
[8]  
Ivanova M, 2006, 2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, P545
[9]  
Ivanova M, 2003, 2003 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, P1124
[10]   Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics [J].
Le Berre, M ;
Launay, S ;
Sartre, V ;
Lallemand, M .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (03) :436-441