Pulsed thermal NDT of materials: back to the basics

被引：28
|
作者：
Vavilov, V. P. [1 ]
机构：
[1] Tomsk Polytech Univ, R-634028 Tomsk, Russia
来源：
NONDESTRUCTIVE TESTING AND EVALUATION | 2007年 / 22卷 / 2-3期
关键词：
thermal NDT; heat conduction; numerical modelling; IR;
D O I：
10.1080/10589750701448407
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The primary objective of this review is to present a close-up outlook at both the terminology and principles of modelling and data processing in thermal nondestructive testing (TNDT). It is shown that development of advanced data treatment algorithms is related to the analysis of heat conduction in solids with subsurface defects. TNDT is practically used in the industrial areas where possible technical failures cause essential financial and/or human losses.
引用
收藏
页码：177 / 197
页数：21
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