Using existing production tools for low-cost thin wafer handling

被引：0

作者：

Le Duc, Philippe ^{[1
]}

Busse, Karl-Hermann ^{[2
]}

Hinn, Michael ^{[2
]}

机构：

[1] NXP ICCN, Thin Films Grp, F-14079 Caen, France

[2] ProTec Proc Syst GmbH, D-57078 Siegen, Germany

来源：

SOLID STATE TECHNOLOGY | 2008年 / 51卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In 2003, NXP CAEN opened a new pilot line dedicated to innovative solutions in system-in-a-package (SIP) on 150mm wafers. For metallization, the challenge was to enable the front- and backside metallization on silicon wafers thinned to 200 mu m without expensive modifications to the existing standard wafer processing equipment. Handling and processing of thin, fragile silicon wafers was demonstrated on a four-chamber MRC Eclipse Mark 11 sputtering system using a mobile electrostatic chuck technology [1, 2] by ProTec Process Systems GmbH. No modification to the Eclipse system was necessary to enable thin wafer handling.

引用

页码：26 / 27

页数：2