Signal Integrity Applications of an EBG Surface

被引:1
|
作者
Matekovits, Ladislau [1 ]
De Sabata, Aldo [2 ]
机构
[1] Politecn Torino, I-10129 Turin, Italy
[2] Politehn Univ Timisoara, Timisoara 300223, Romania
关键词
circuit noise; electromagnetic propagation; microwave integrated circuits; IMPEDANCE ELECTROMAGNETIC SURFACES; PARALLEL-PLATE NOISE; BANDGAP STRUCTURES; WAVE-GUIDE; SUPPRESSION; REDUCTION; DESIGN; PLANE;
D O I
10.4316/AECE.2015.02001
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
Electromagnetic band-gap (EBG) surfaces have found applications in mitigation of parallel-plate noise that occurs in high speed circuits. A 2D periodic structure previously introduced by the same authors is dimensioned here for adjusting EBG parameters in view of meeting applications requirements by decreasing the phase velocity of the propagating waves. This adjustment corresponds to decreasing the lower bound of the EBG spectra. The positions of the EBGs' in frequency are determined through full-wave simulation, by solving the corresponding eigenmode equation and by imposing the appropriate boundary conditions on all faces of the unit cell. The operation of a device relying on a finite surface is also demonstrated. Obtained results show that the proposed structure fits for the signal integrity related applications as verified also by comparing the transmission along a finite structure of an ideal signal line and one with an induced discontinuity.
引用
收藏
页码:3 / 8
页数:6
相关论文
共 50 条
  • [1] Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications
    Olivieri, Carlo
    de Paulis, Francesco
    Orlandi, Antonio
    Koziel, Slawomir
    SIMULATION-DRIVEN MODELING AND OPTIMIZATION, 2016, 153 : 111 - 133
  • [2] Signal Integrity Analysis of Embedded Planar EBG Structures
    de Paulis, Francesco
    Raimondo, Leo
    Orlandi, Antonio
    2010 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & TECHNICAL EXHIBITION ON EMC RF/MICROWAVE MEASUREMENTS & INSTRUMENTATION, 2010, : 330 - 333
  • [3] Signal integrity;Practical EBG application to multilayer PCB: impact on power integrity
    De Paulis, F.
    Nisanci, M.H.
    Orlandi, A.
    Fan, Jun
    IEEE Electromagnetic Compatibility Magazine, 2012, 1 (03) : 60 - 65
  • [4] Signal Integrity Enhanced EBG Structure With a Ground Reinforced Trace
    Kim, Sang-Gyu
    Kim, Hyun
    Kang, Hee-do
    Yook, Jong-Gwan
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (04): : 284 - 288
  • [5] Practical EBG application to multilayer PCB: Impact on signal integrity
    Nisanci, M.H.
    De Paulis, F.
    Di Febo, Danilo
    Orlandi, A.
    IEEE Electromagnetic Compatibility Magazine, 2013, 2 (02) : 82 - 87
  • [6] Signal Integrity Improvement in Transmission Lines Backed by an EBG Structure
    Chen, Jin
    Abhari, Ramesh
    2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2008, : 289 - 292
  • [7] Enhanced Signal and Power Integrity using Novel Planar EBG design
    Bansode, Manisha R.
    Rathod, Surendra S.
    2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMIC, 2023, : 5 - 8
  • [8] Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures
    Sindhadevi, M.
    Kanagasabai, Malathi
    Arun, Henridass
    Shrivastav, A. K.
    JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY, 2016, 11 (01) : 175 - 183
  • [9] Signal Integrity Analysis of Single-Ended and Differential Signaling in PCBs with EBG structure
    Scogna, A. Ciccomancini
    Orlandi, A.
    Ricchiuti, V.
    2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 12 - +
  • [10] Signal and power integrity performances of striplines in presence of 2D EBG planes
    Scogna, A. Ciccomancini
    Orlandi, A.
    Ricciuti, V.
    2008 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2008, : 28 - +