Curing and morphology of epoxy resin silica hybrids

被引:39
|
作者
Mascia, L [1 ]
Tang, T [1 ]
机构
[1] Loughborough Univ Technol, Inst Polymer Technol & Mat Engn, Loughborough LE11 3TU, Leics, England
关键词
D O I
10.1039/a805144e
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Hybrids of epoxy resin and silica cured respectively with methyl nadic anhydride (MNA) and 4,4'-diaminodiphenyl sulfone (DDS) were prepared. Control of the morphology was;achieved through functionalisation of a; diglycidyl ether resin respectively with monofunctional:and difunctional secondary amine trialkoxysilanes. prior to being mixed with a solution of tetraethoxysilane (TEOS) and hardener. Scanning and transmission electron microscopy examinations (SEM and TEM) were carried but to study the: morphology of the samples. The results have shown that the preparation conditions and nature of solvent play a vital role in the compatibilisation of the final hybrid. The addition of a hydrolysed TEOS solution into the epoxy resin to produce the corresponding hybrid was found to interfere with the cross-linking reactions with the hardener, inevitably resulting in a reduction in the T-g of the epoxy resin component. This was attributed to side reactions of MNA with the ethanol released from hydrolysis and condensation df the TEOS, producing monofunctional and difunctional esters which act as plasticisers and to decreased functionality of the epoxy resin from the reaction with the HCl used for the hydrolysis of TEOS.
引用
收藏
页码:2417 / 2421
页数:5
相关论文
共 50 条
  • [31] HEAT OF REACTION AND CURING OF EPOXY-RESIN
    CHANG, SS
    JOURNAL OF THERMAL ANALYSIS, 1988, 34 (01): : 135 - 154
  • [32] Influence of aluminosilsesquioxane on epoxy resin curing process
    Matykiewicz, Danuta
    Dudziec, Beata
    Sterzynski, Tomasz
    POLIMERY, 2014, 59 (11-12) : 855 - 858
  • [33] Curing studies on epoxy resin with phosphorylated amine
    Alam, S
    Jayakumari, VG
    Kandpal, LD
    Mathur, GN
    INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 1999, 6 (02) : 93 - 99
  • [34] ASPECTS OF EPOXY-RESIN CURING REACTIONS
    BARTON, JM
    MAKROMOLEKULARE CHEMIE-MACROMOLECULAR SYMPOSIA, 1987, 7 : 27 - 36
  • [35] Microencapsulation of imidazole curing agent for epoxy resin
    Ham, Young Rok
    Lee, Dong Ho
    Kim, Sun Hee
    Shin, Young Jae
    Yang, Minhee
    Shin, Jae Sup
    JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, 2010, 16 (05) : 728 - 733
  • [36] Curing behaviors of MOCA/epoxy resin system
    Gan, Hou-Lei
    Yi, Chang-Hai
    Lu, Peng-Ju
    Chen, Jie
    Xu, Wei-Lin
    Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering, 2009, 25 (02): : 119 - 122
  • [37] Effect of microwave radiation on curing of epoxy resin
    Zhang, Jun-Ying
    Cai, Xiao-Xia
    Gu, Xiao-Yu
    Liu, Ling
    Beijing Huagong Daxue Xuebao (Ziran Kexueban)/Journal of Beijing University of Chemical Technology (Natural Science Edition), 2004, 31 (04):
  • [38] Study on moderate temperature curing epoxy resin
    Jiao, Jian
    Lan, Liwen
    Ning, Rongchang
    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2000, 17 (02): : 8 - 11
  • [39] Dual curing of an epoxy resin with dicarboxylic acids
    Morancho, J. M.
    Ramis, X.
    Fernandez-Francos, X.
    Konuray, O.
    Salla, J. M.
    Serra, A.
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2020, 142 (02) : 607 - 615
  • [40] On the Nature of Epoxy Resin Post-Curing
    Moller, James C.
    Berry, Rajiv J.
    Foster, Heather A.
    POLYMERS, 2020, 12 (02)