High-Resolution, High-Aspect-Ratio Printed and Plated Metal Conductors Utilizing Roll-to-Roll Microscale UV Imprinting with Prototype Imprinting Stamps

Micron-scale, high-aspect-ratio features were imprinted by a roll-to-roll process into a UV-curable polymer and used to create high-current-carrying conductive networks on plastic substrates. A stamp fabrication method was developed to create low-cost, rapidly produced roll-to-roll imprinting stamps, which can mold features from 3 mu m to 1 mm wide. Isolated raised features 50 mu m high were molded from a 25-mu m-thick layer of UV-curable resin by displacing resin into raised features in the stamp. Substrates with imprinted capillary channels were used to form electrical conductors by printing a silver ink into reservoirs connected to the channels and allowing capillary flow to coat plating then filled the channels. The conductors demonstrate high resolution, high aspect resistance per length, and easy integration into networks. This roll-to-roll imprinting process throughput manufacturing of high-resolution printed electronics. the channel. Copper electroless ratio (similar to 5:1 height:width), low provides a foundation for high-throughput manufacturing of high-resolution printed electronics.