Low-temperature thermal bonding of PMMA microfluidic chips

被引：46
作者：
Li, JH [1 ]
Chen, D
Chen, G
机构：
[1] Shanghai Jiao Tong Univ, State Lab Micronanometer Fabricat Technol, Key Lab Thin Film & Microfabricat Technol, Minist Educ,Res Inst Micronanometer Sci & Technol, Shanghai 200030, Peoples R China
[2] Fudan Univ, Dept Chem, Shanghai 200433, Peoples R China
来源：
ANALYTICAL LETTERS | 2005年 / 38卷 / 07期
关键词：
microfluidic chips; PMMA substrate; low-temperature bonding;
D O I：
10.1081/AL-200057209
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
A new method for thermally bonding poly(methyl methacrylate) (PMMA) substrates to form microfluidic chips is described. A PMMA substrate is first replicated by means of hot embossing with a metal template. Then a layer of low molecular weight PMMA film is formed on the PMMA cover plate by spin coating. Thermal bonding for channel enclosure is accomplished by heating the clamped PMMA substrate and cover plate at 95 degrees C for 20 min. The cross section demonstrated by the SEM photographs shows no obvious change has appeared. The functionality of these low temperature-bonded microfluidic substrates was demonstrated by performing high-resolution electrophoretic separations of the mixture of hydrazine compound.
引用
收藏
页码：1127 / 1136
页数：10
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