The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga

被引：27

作者：

Chen, KI ^{[1
]}

Lin, KL

机构：

[1] Tung Fang Inst Technol, Dept Elect & Informat, Kaohsiung 829, Taiwan

[2] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 10期

关键词：

lead-free solder; Sn-Zn; Sn-Zn-Ag; Ga; mechanical properties; differential scanning calorimetry (DSC);

D O I：

10.1007/s11664-003-0096-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The microstructures and mechanical properties of Sn-8.55M-0.5Ag-0.45Al-yGa (wt.%) lead-free solders were investigated. The y content of the solders investigated was 0.5-3.0 wt.%. The results indicate that Ga exhibits prominent influence in the microstructure as well as mechanical properties of the solders. By increasing Ga, the fraction of the Sn/Zn eutectic region decreases and the Sn-matrix region increases. An increase in the Ga content from 0.5 wt.% to 2.0 wt.% enhances the tensile strength while degrading the ductility. The mechanical properties and differential scanning calorimetry (DSC) behavior have been compared with that of the 63Sn-37Pb solder. Gallium lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater tensile strength and better ductility than the 63Sn-37Pb solder.

引用

页码：1111 / 1116

页数：6

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