Role of stress in the self-limiting oxidation of copper nanoparticles

The oxidation process of Cu nanoparticles has been investigated by means of an in-situ X-ray diffraction method. A self-limiting oxidation process involving an unusually drastic decrease (about 4 orders in magnitude) in the oxidation rate was observed at 298 K, whereas a non-self-limiting oxidation emerged at 323 K with a rate of at least 4 orders in magnitude faster than 298 K. The drastic slowing at 298 K and the big differences between the two close temperatures in the oxidation kinetics were found to be directly correlated to whether the compressive stress in the Cu2O(111) layers that commensurately formed on the Cu(111) surface is relaxed or not.