Surface finish prediction models for precision grinding of silicon

被引:24
|
作者
Alao, Abdur-Rasheed [1 ]
Konneh, Mohamed [2 ]
机构
[1] Univ Malaya, Fac Engn Bldg, Dept Engn Design & Manufacture, Adv Mfg & Mat Proc Technol AMMPT Lab, Kuala Lumpur 50603, Malaysia
[2] IIUM, Dept Mfg & Mat Engn, Kuala Lumpur 50728, Malaysia
来源
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2012年 / 58卷 / 9-12期
关键词
Precision grinding; Box-Behnken design; Silicon; Surface roughness parameters; Empirical models; Analysis of variance; DUCTILE; CHIPS; OPTIMIZATION; WHEEL;
D O I
10.1007/s00170-011-3438-8
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Conventional grinding of silicon substrates results in poor surface quality unless they are machined in ductile mode on expensive ultra-precision machine tools. However, precision grinding can be used to generate massive ductile surfaces on silicon so that the polishing time can be reduced immensely and surface quality improved. However, precision grinding has to be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this work reports the empirical models developed for surface parameters R (a), R (max), and R (t) with precision grinding parameters, depths of cut, feed rates, and spindle speeds using conventional numerical control machine tools with Box-Behnken design. Second-order models are developed for the surface parameters in relation to the grinding parameters. Analysis of variance is used to show the parameters as well as their interactions that influence the roughness models. The models are capable of navigating the design space. Also, the results show large amounts of ductile streaks at depth of cut of 20 mu m, feed rate of 6.25 mm/min, and spindle speed of 70,000 rpm with a 43-nm R (a). Optimization experiments by desirability function generate 37-nm R (a), 400-nm R (max), and 880-nm R (t) with massive ductile surfaces.
引用
收藏
页码:949 / 967
页数:19
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