An ultra-fast photonic ring network employing Optical Packet Compression-Time Division Multiplexing (OPC-TDM) scheme

被引：1

作者：

Aleksic, S ^{[1
]}

机构：

[1] Vienna Univ Technol, Inst Commun Networks, A-1040 Vienna, Austria

来源：

ELECTRICAL ENGINEERING | 2001年 / 83卷 / 04期

关键词：

Network Performance; Packet Size; Extensive Simulation; High Compression; Compression Rate;

D O I：

10.1007/s002020100079

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An ultra-fast photonic ring network employing full-scalable Optical Packet Compression TDM (OPC-TDM) scheme is investigated in this paper. Moreover, a new optical packet compression/decompression unit is proposed, which allows high compression rates and large packet sizes thereby relaxing the medium access constraints. The extensive simulations are performed in order to investigate the feasibility of the proposed compression/decompression scheme. The improvement of the OPC-TDM network performance achieved by reducing the rate-conversion latency is shown.

引用

页码：223 / 229

页数：7

共 4 条

[1] An ultra-fast photonic ring network employing Optical Packet Compression-Time Division Multiplexing (OPC-TDM) scheme
S. Aleksić
Electrical Engineering, 2001, 83 : 223 - 229
[2] OPC-TDM network performance improvement by the use of full-scalable optical packet compression/decompression units
Aleksic, S
Bengi, K
Krajinovic, V
TOWARDS AN OPTICAL INTERNET: NEW VISIONS IN OPTICAL NETWORK DESIGN AND MODELLING, 2002, 76 : 263 - 273
[3] Optical code-division multiplexing and its application to ultra-fast photonic networks
Sotobayashi, H
ROMOPTO 2003: SEVENTH CONFERENCE ON OPTICS, 2004, 5581 : 26 - 39
[4] Assessment and mitigation of Erbium-doped fibre amplifiers (EDFA) gain transients in hybrid wavelength division multiplexing/time division multiplexing passive optical network (WDM/TDM PON) in the presence of packet-based traffic
Neto, B.
Reis, C.
Dionisio, R. P.
Ferreira, J. M.
Lazaro, J. A.
Tosi-Beleffi, G.
Pinto, A. N.
Nogueira, R.
Teixeira, A.
Prat, J.
Andre, P. S.
IET OPTOELECTRONICS, 2010, 4 (06) : 219 - 225

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