Robustness evaluation using highly accelerated life testing

被引：14
作者：
Charki, Abderafi [1 ]
Laronde, R. [1 ]
Guerin, F. [1 ]
Bigaud, D. [1 ]
Coadou, F. [1 ]
机构：
[1] Univ Angers, LASQUO, ISTIA, F-49000 Angers, France
来源：
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2011年 / 56卷 / 9-12期
关键词：
Accelerated testing; Reliability; Robustness;
D O I：
10.1007/s00170-011-3264-z
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper presents experimental aspects and results of highly accelerated life testing in order to study the robustness of electronic boards subject to two main covariates: thermal and vibration stresses. Statistical analysis of test results and assessment of the product quality characteristics under different conditions (operating and destruction limits) are presented. Recommendations for further testing are also presented.
引用
收藏
页码：1253 / 1261
页数：9
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