High-temperature strength and room-temperature toughness of Nb-W-Si-B alloys prepared by arc-melting

被引:76
作者
Sha, J [1 ]
Hirai, H
Tabaru, T
Kitahara, A
Ueno, H
Hanada, S
机构
[1] Natl Inst Adv Ind Sci & Technol, Inst Struct & Engn Mat, Tosu, Saga 8410052, Japan
[2] Natl Inst Adv Ind Sci & Technol, Collaborat Dept, Tosu, Saga 8410052, Japan
[3] Tohoku Univ, Mat Res Inst, Sendai, Miyagi 9808577, Japan
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 364卷 / 1-2期
基金
日本科学技术振兴机构;
关键词
niobium solid solution; niobium silicide; high-temperature strength; fracture toughness; boron;
D O I
10.1016/j.msea.2003.08.014
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
As next generation ultra-high temperature structural materials, the balance between high-temperature strength and room-temperature toughness of the Nb-base in-situ composites is the most important issue. This paper investigated the mechanical behavior of Nb-10W-10Si-xB (x = 0, 0. 1, 1 and 2). Materials were prepared by arc-melting and annealed at 1870 K for 100 h. The microstructures of the Nb-10W-10Si-xB But those were increased at 2 mol% B. All the alloys have more than 7% compressive ductility at room temperature. B improves both the room-temperature toughness (K-Q) and the high-temperature strength (sigma(max)). The K-Q and the sigma(max) of the Nb-10W- 10Si alloy at 1670 K are 8.2 MPa m(1/2) and 400 MPa, respectively, and are 8.8 MPa m(1/2) and 470 MPa in the Nb-10W-10Si-2B alloy. With two-phase Nb-ss/Nb5Si3 microstructures, the compressive damage at high temperature was dominated by debonding of the interfaces between the primary Nb-ss and the 5-3 silicide, while the fracture mode at room temperature is transgranular, controlled by the primary Nbss cleavage. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:151 / 158
页数:8
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