Banding in copper friction stir weld

被引：12
作者：
Savolainen, K. [1 ]
Saukkonen, T. [1 ]
Hanninen, H. [1 ]
机构：
[1] Aalto Univ, Sch Engn, Helsinki, Finland
来源：
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING | 2012年 / 17卷 / 02期
关键词：
Copper; Friction stir welding; Banding; DYNAMIC RECRYSTALLIZATION; GRAIN-STRUCTURE; TEXTURE; MICROSTRUCTURE; NUCLEATION; FLOW;
D O I：
10.1179/1362171811Y.0000000089
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Formation and microstructure of banding in a copper friction stir weld was studied using scanning electron microscopy, electron backscatter diffraction, and nanoindentation. Unlike in aluminium, banding only appears in 'cold' friction stir welding (FSW) welds of copper. Banding is formed by layers of small and large grains. It was noticed that higher local misorientations and small grain size correlate in the welds. Owing to differences in the restoration processes of copper and aluminium, texture changes are not visible in copper even though they are in aluminium. Texture of copper FSW welds is weak and independent of the grain structure of the base material, because in the steady state dynamic recrystallisation, the restoration process of copper, the grain structure is mainly dependent of the processing parameters. The hardness differences between the small and large grains are small.
引用
收藏
页码：111 / 115
页数：5
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