A new approach to analysis and optimization of evaporative cooling system II: Applications

被引:77
|
作者
Chen, Qun [1 ]
Pan, Ning [2 ]
Guo, Zeng-Yuan [1 ]
机构
[1] Tsinghua Univ, Dept Mech Engn, Minist Educ, Key Lab Thermal Sci & Power Engn, Beijing 100084, Peoples R China
[2] Univ Calif Davis, Dept Biol & Agr Engn, Davis, CA 95616 USA
基金
中国国家自然科学基金;
关键词
Evaporative cooling; Moisture entransy; Moisture entransy dissipation; Minimum thermal resistance law; Optimization; MASS-TRANSFER PROCESSES; HEAT-TRANSFER; IRREVERSIBLE-PROCESSES; RECIPROCAL RELATIONS; WATER SPRAY; AMBIENT AIR; COOLER IEC; PERFORMANCE; TOWER; ENTRANSY;
D O I
10.1016/j.energy.2011.02.031
中图分类号
O414.1 [热力学];
学科分类号
摘要
After introducing the concepts of moisture entransy, moisture entransy dissipation and thermal resistance based on moisture entransy dissipation (TRMED) in part I of this study, we further analyze several direct/indirect evaporative cooling processes based on the above concepts in this part. The nature of moisture entransy, moisture entransy dissipation and TRMED during evaporative cooling processes was reexamined. The results demonstrate that it is the moisture entransy, not the enthalpy, that represents the endothermic ability of a moist air, and reducing the entransy dissipation by both enlarging the thermal conductance of heat and mass transfer, and decreasing the temperature potential of the moist air, i.e. the difference between the dry-bulb temperature of moist air over its dew-point temperature, will result in a smaller system TRMED, and consequently a better evaporative cooling performance. Then, a minimum thermal resistance law for optimizing evaporative cooling systems is developed. For given mass flow rates of both moist air and water, with prescribed moist air and water conditions, minimizing the TRMED will actually lead to the most efficient evaporative cooling performance. Finally, the thermal conductance allocation for an indirect evaporative cooling system is optimized to illustrate the application of the proposed minimum thermal resistance law. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2890 / 2898
页数:9
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