Thermal analysis of cured halogenated bisphenol-C-epoxy resins

被引：4
作者：
Gadhia, ST [1 ]
Joshi, JK [1 ]
Parsania, PH [1 ]
机构：
[1] Saurashtra Univ, Dept Chem, Polymer Sci Div, Rajkot 360005, Gujarat, India
来源：
POLYMER DEGRADATION AND STABILITY | 2005年 / 88卷 / 02期
关键词：
halogenated epoxy resins; hardeners; thermal analysis;
D O I：
10.1016/j.polymdegradstab.2004.09.012
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Halogenated epoxy resins of 1,1'bis(R,R',4-hydroxy phenyl)cyclohexane (ECB: R = R' = Cl; ECM: R = CH3 and R' = Cl and EBB: R = R' = Br) were cured using 10-50% pyromellitic dianhydride (PMDA), tetrachlorophthalic anhydride (TCP), 1,1'bis(4-amino phenyl) methane (DDM) and 1,1'-bis (4-amino phenyl) cyclohexane (DDC) as curing agents at 230/150 degrees C. PMDA and TCP cured resins are insoluble in common solvents while DDC and DDM cured resins are soluble. In order to understand degradation kinetics, TG-DTA of cured resins was carried out at the heating rate of 15 degrees C/min in nitrogen atmosphere. Resins are thermally stable up to about 300-360 degrees C and involved two-step decomposition reactions. Endo- or exothermic DTA transitions supported either chemical or physical changes. (c) 2004 Elsevier Ltd. All rights reserved.
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页码：217 / 223
页数：7
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