Atomic layer deposition of HfO2 thin films and nanolayered HfO2-Al2O3-Nb2O5 dielectrics

被引:34
作者
Kukli, K
Ritala, M
Leskelä, M
Sajavaara, T
Keinonen, J
机构
[1] Univ Helsinki, Dept Chem, FIN-00014 Helsinki, Finland
[2] Univ Helsinki, Accelerator Lab, FIN-00014 Helsinki, Finland
[3] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA
[4] Univ Tartu, Inst Expt Phys & Technol, EE-51010 Tartu, Estonia
关键词
D O I
10.1023/A:1023948617372
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Smooth, 4-6-nm thick hafnium oxide films were grown by atomic layer deposition from Hfl(4) or HfCl4 and H2O on SiO2/Si(100) substrates at 300degreesC. Non-uniform films were obtained on hydrogen-terminated Si(100). The stoichiometry of the films corresponded to that of HfO2. The films contained small amounts of residual chlorine and iodine. The films deposited on SiO2/Si(100) were amorphous, but crystallized upon annealing at 1000degreesC. In order to decrease the conductivity, the HfO2 films were mixed with Al2O3, and to increase the capacitance, the films were mixed with Nb2O5. The capacitance-voltage curves of the Hf-Al-O mixture films showed hysteresis. The capacitance-voltage curves of HfO2 films and mixtures of Hf-Al-Nb-O were hysteresis free. (C) 2003 Kluwer Academic Publishers.
引用
收藏
页码:361 / 367
页数:7
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