PVD HfO2 for high-precision MIM capacitor applications

被引:58
作者
Kim, SJ [1 ]
Cho, BJ
Li, MF
Yu, XF
Zhu, CX
Chin, A
Kwong, DL
机构
[1] Natl Univ Singapore, Silicone Nano Device Lab, Dept Elect & Comp Engn, Singapore 119260, Singapore
[2] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan
[3] Univ Texas, Dept Elect & Comp Engn, Austin, TX 78752 USA
关键词
capacitance density; HfO2; metal-insulator-metal (MIM) capacitor; sputter; voltage coefficient of capacitor (VCC);
D O I
10.1109/LED.2003.813381
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Metal-insulator-metal (MIM) capacitors are fabricated using sputtered HfO2 with Ta and TaN for top and bottom electrodes, respectively. High-capacitance densities from 4.7 to 8.1 fF/mum(2) have been achieved while maintaining the leakage current densities around 1 x 10(-8) A/cm(2) within the normal circuit bias conditions. A guideline for the insulator thickness and its dielectric constant has been obtained by analyzing the tradeoff between the linearity coefficient and the capacitance density.
引用
收藏
页码:387 / 389
页数:3
相关论文
共 14 条
[11]   Advanced dielectrics for gate oxide, DRAM and rf capacitors [J].
van Dover, RB ;
Fleming, RM ;
Schneemeyer, LF ;
Alers, GB ;
Werder, DJ .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :823-826
[12]   Investigation of PECVD dielectrics for nondispersive metal-insulator-metal capacitors [J].
Van Huylenbroeck, S ;
Decoutere, S ;
Venegas, R ;
Jenei, S ;
Winderickx, G .
IEEE ELECTRON DEVICE LETTERS, 2002, 23 (04) :191-193
[13]  
Yoshitomi T., 1999, IEEE BCTM, P133
[14]   Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies [J].
Zurcher, P ;
Alluri, P ;
Chu, P ;
Duvallet, A ;
Happ, C ;
Henderson, R ;
Mendonca, J ;
Kim, M ;
Petras, M ;
Raymond, M ;
Remmel, T ;
Roberts, D ;
Steimle, B ;
Stipanuk, J ;
Straub, S ;
Sparks, T ;
Tarabbia, M ;
Thibieroz, H ;
Miller, M .
INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, :153-156