The effect of electrolyte layer thickness on electrochemical migration of tin

被引:31
作者
Zhong, Xiankang [1 ]
Zhang, Guoan [2 ]
Guo, Xingpeng [2 ]
机构
[1] Southwest Petr Univ, Sch Oil & Nat Gas Engn, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Chem & Chem Engn, Key Lab Large Format Battery Mat & Syst, Minist Educ, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金;
关键词
Tin; Anodic dissolution; CHLORIDE; CORROSION;
D O I
10.1016/j.corsci.2015.04.014
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, electrochemical migration behaviour of tin under electrolyte layers with different thicknesses was investigated using thin electrolyte layer method. The results show that the time to short circuit first increases and then decreases with increasing thickness of the electrolyte layer, the maximum value is present at 100 mu m. Inductively Coupled Plasma Source Mass Spectrometer was employed to measure the local concentration of tin ions. The result shows that the lowest local concentration of tin ions is present at the 100-mu m-thick electrolyte layer, resulting in a maximum value in the time to short circuit. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1 / 5
页数:5
相关论文
共 10 条
[1]   TUTORIAL - ELECTROLYTIC MODELS FOR METALLIC ELECTROMIGRATION FAILURE MECHANISMS [J].
KRUMBEIN, SJ .
IEEE TRANSACTIONS ON RELIABILITY, 1995, 44 (04) :539-549
[2]   Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics [J].
Lee, Shin-Bok ;
Lee, Ho-Young ;
Jung, Min-Suk ;
Park, Young-Bae ;
Joo, Young-Chang .
METALS AND MATERIALS INTERNATIONAL, 2011, 17 (04) :617-621
[3]   Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics [J].
Medgyes, Balint ;
Horvath, Barbara ;
Illes, Balazs ;
Shinohara, Tadashi ;
Tahara, Akira ;
Harsanyi, Gabor ;
Krammer, Oliver .
CORROSION SCIENCE, 2015, 92 :43-47
[4]   Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37 [J].
Medgyes, Balint ;
Illes, Balazs ;
Harsanyi, Gabor .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (02) :551-556
[5]   On the electrochemical migration mechanism of tin in electronics [J].
Minzari, Daniel ;
Jellesen, Morten S. ;
Moller, Per ;
Ambat, Rajan .
CORROSION SCIENCE, 2011, 53 (10) :3366-3379
[6]   Electrochemical migration of tin in electronics and microstructure of the dendrites [J].
Minzari, Daniel ;
Grumsen, Flemming Bjerg ;
Jellesen, Morten S. ;
Moller, Per ;
Ambat, Rajan .
CORROSION SCIENCE, 2011, 53 (05) :1659-1669
[7]   Influence of electrolyte layer thickness and pH on the initial stage of the atmospheric corrosion of iron [J].
Nishikata, A ;
Ichihara, Y ;
Hayashi, Y ;
Tsuru, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (04) :1244-1252
[8]   Electrochemical migration of tin in thin electrolyte layer containing chloride ions [J].
Zhong, Xiankang ;
Zhang, Guoan ;
Qiu, Yubing ;
Chen, Zhenyu ;
Guo, Xingpeng .
CORROSION SCIENCE, 2013, 74 :71-82
[9]   In situ study the dependence of electrochemical migration of tin on chloride [J].
Zhong, Xiankang ;
Zhang, Guoan ;
Qiu, Yubin ;
Chen, Zhenyu ;
Zou, Wenxin ;
Guo, Xingpeng .
ELECTROCHEMISTRY COMMUNICATIONS, 2013, 27 :63-68
[10]   The corrosion of tin under thin electrolyte layers containing chloride [J].
Zhong, Xiankang ;
Zhang, Guoan ;
Qiu, Yubin ;
Chen, Zhenyu ;
Guo, Xingpeng ;
Fu, Chaoyang .
CORROSION SCIENCE, 2013, 66 :14-25